東芝ユニファイドテクノロジーズ 東京事業所 検査システム営業部 Official site

High-Speed Camera X-ray Inspection System 'TOSRAY-HSC Series'

Visualize that moment! You can visualize the behavior inside the product.

The "TOSRAY-HSC" is a high-speed X-ray imaging inspection system that visualizes the internal structure of products through a combination of X-rays and high-speed cameras, allowing for drop tests and high-speed filming that were previously only observable from the exterior. This eliminates the need to remake the exterior with transparent materials, enabling observation in the actual material state, thereby improving reliability. 【Features】 ○ Allows observation of high-speed behavior inside objects that cannot be seen with conventional X-ray imaging devices. ○ Capable of high-speed filming at approximately 20,000 frames per second. (Combination of high-sensitivity, fast-response X-ray sensors and high-sensitivity high-speed cameras) ○ Maximum imaging area of φ200mm. ○ Eliminates the hassle of remaking the exterior with transparent materials, allowing for observation in the actual material state. ○ Customization and optional mechanisms tailored to the subject of filming can be proposed. For more details, please contact us or download the catalog.

Related Link - http://www.toshiba-itc.com/cat/products/high_speed…

basic information

【Features】 ○ CT scanner & high-speed X-ray system multifunction device Combined with a micro CT device, enabling 3D analysis and examination ○ Compatible with environmental testing equipment such as vibration and temperature testers ○ Installation proposals can also be made for existing X-ray fluoroscopy inspection devices ○ Multiple cameras can be synchronized to observe appearance images and X-ray fluoroscopy images simultaneously ● For more details, please contact us or download the catalog.

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Applications/Examples of results

【Applications】 ○ Observation of internal behavior during the drop of precision instruments (such as deformation of circuit boards and components in mobile phones and digital cameras) ○ Analysis of damage processes in electrical and electronic components, confirmation of the behavior of mechanical moving parts (such as relay contacts) ○ Flow observation of fluids and powders, observation of welding phenomena, etc. ● For more details, please contact us or download the catalog.

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