Microfocus X-ray fluoroscopy inspection device 'TXV-CH4090FD'
Ideal for solder inspection of the implementation board. Observation from an oblique direction is also possible.
<Specifications> - X-ray device: 90kV, focal point: 5μm - Table size: 400×350mm - Tilt angle: 0 to 60 degrees - Magnification: 10 to 160 times <Features> - Equipped with a maintenance-free sealed tube type micro-focus. - Features a flat panel sensor with high image representation capability, providing clear images without distortion. - Allows observation from an angled direction through tilted imaging. Additionally, it is equipped with a tracking function that ensures no observation points are missed during tilted imaging. - Includes BGA void measurement software. - Comfortable user interface that allows all operations on a PC screen. - Compact design that does not require a specific installation location.
basic information
A system optimal for solder inspection of implementation boards. With the incorporation of a flat panel sensor, clear images without distortion can be obtained. The sensor can tilt up to 60 degrees, allowing for observation from an angled direction. An excellent user interface enables easy and efficient inspection.
Price information
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Delivery Time
Model number/Brand name
TXV-CH4090FD
Applications/Examples of results
- Solder inspection of the implementation board - BGA void measurement - Other applications are widely available.
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As of April 25, the company name has been changed. [Formerly: Toshiba IT Control Systems Corporation] Our company provides design, manufacturing, sales, and services of X-ray non-destructive testing systems in various fields both domestically and internationally. We respond to the diverse needs of our customers, including automotive equipment, consumer electronics, and research institutions, and work on solving their challenges. By leveraging the latest technology and extensive experience, we continue to provide excellent solutions to meet our customers' challenges.