The 42nd Internepcon Japan 2013 will be held for three days from January 16 (Wednesday) to January 18 (Friday) at the Tokyo International Exhibition Center (Tokyo Big Sight). Exhibition Booth: East Hall 5, Booth No. East 42-32 At our booth, we will showcase essential products for reducing defect rates and improving productivity on the assembly line! Experience the "EPSON Automated Robot for Insertion of Irregular Parts," which proposes cost reduction through factory automation, and the "CyberOptics Desktop High-Speed Appearance Inspection Device," developed with a unique image acquisition method themed around speed, simplicity, and visibility. We will also exhibit "FPC and Thin Substrate Transport Carriers" tailored to customer needs, "Flow Carriers for Post-SMT," and the "Next-Generation Metal Mask," which achieves high-quality solder paste printing by generating special resin on metal surfaces (P-surface and opening cross-section). We sincerely look forward to your visit despite your busy schedule. ≪Exhibited Products≫ - EPSON Automated Robot for Insertion of Irregular Parts - CyberOptics Desktop Appearance Inspection Device QX100 - SMT Transport Carriers - ER Metal Masks