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  Disaster prevention supplies(1)

  We would like to introduce the "disaster prevention products" that we handle.

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  machine(7)

  I will introduce you to "equipment."

• Metal mask(6)

  We manufacture various types of metal masks for implementation printing.

• Screen mask(3)

  We will evaluate the functionality of the plate in terms of resolution, adhesion between the plate and material, hardness, solvent resistance, and other factors, and produce the desired mask using our unique methods.

• Screen mask material(1)

  This is an introduction to screen mask materials.

• Transport pallet(15)

  It is a transport jig for flexible substrates/thin substrates.

• Adhesive sheet(2)

  It is an adhesive sheet used for alignment, material protection, and during mounting.

• Substrate assembly surface cleaning machine(2)

  It is an inline cleaning machine that removes processing debris and static electricity attached to the substrate before solder printing.

• Electronic components storage room(2)

  It is ideal for moisture-proof storage of IC packages and printed circuit boards, prevention of oxidation (corrosion) of electronic components, and low-humidity storage of polymer materials. There are also types that can store tape feeders in the storage cabinet.

• Adhesives, cleaning agents, tape(5)

  Introduction of chip adhesives, conductive adhesives and tapes, as well as cleaning agents for metal masks and screen printing plates.

• Washing machine(4)

  Introducing the metal mask cleaning machine and automatic nozzle cleaning machine.

• Consumable materials(6)

  Introduction of consumable materials.

• Soldering management device(3)

  This is an introduction to the cream solder life management device and the cream solder automatic supply machine.

• Backup jig(2)

  This is an introduction to backup jigs for high-precision printing machines and their mounted equipment.

• Solvent regeneration device(0)

  Used dirty solvent will be regenerated into a colorless and transparent solvent.

• Rework device(0)

  This is an introduction to spot reflow that allows for the removal and retrofitting of SMDs (such as BGA, CSP, LGA, QFP, etc.).

• Reflow oven(1)

  Conventional reflow ovens exhaust hot air containing volatile organic compounds (VOCs) generated during the heating of flux through exhaust ducts to the outside of the factory. This simultaneously requires the intake of outside air, which must be heated to the set temperature, resulting in power consumption losses. The GT reflow oven employs an internal air circulation method using two functions: "catalyst" and "flux recovery box," to suppress the exhaust heat to the outside of the oven and operate in an energy-saving manner unaffected by outside air temperature.

Product/Service List (60)