DIP tank transport carrier, optimal for substrate transport fixtures and soldering fixtures.
This is an optimal DIP tank transport carrier processed using CDM, an ultra-high heat-resistant material, suitable for substrate transport fixtures and soldering fixtures.
Various specifications are available, including micro-machining specifications, parts, specifications with substrate holding functions, bridge killer specifications, adjustable carrier specifications, and specifications with angle adjustment functions.
basic information
This is a DIP tank transport carrier, optimized for substrate transport and soldering, made using the ultra-high heat-resistant material CDM. - After inserting the components, set them in the carrier. ↓ - Solder will only adhere to the opening of the carrier. ↓ - Soldering is complete. ■ Fine Processing Specification This specification can accommodate cases that require fine processing. ■ Component and Substrate Holding Function Specification This specification utilizes spring pins for holding components and substrates, which also shortens the substrate setting time. ■ Bridge Killer Specification This is proposed as an item for cases where bridging cannot be resolved. ■ Adjustable Carrier Specification Multiple substrates can be set and fed into the flow layer. This eliminates the need for flow line width adjustments, providing the benefit of easier setup changes. ■ Angle Adjustment Function Specification This item is designed to achieve optimal soldering conditions. It can rotate 360 degrees, allowing for condition setting with a single carrier. For more details, please check the 'Download' section.
Price information
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Delivery Time
Applications/Examples of results
As a substrate transport fixture and soldering fixture.
