ER metal mask
This is an ER metal mask that demonstrates excellent effectiveness in the printing process of printed circuit boards.
This is a next-generation metal mask that achieves high-quality solder paste printing by generating a special resin on the metal surface (P surface and opening cross-section).
basic information
This is an ER metal mask that demonstrates excellent effects in the printing process of printed circuit boards. By generating a special resin on the metal surface (P surface and opening cross-section), it is a next-generation metal mask that achieves high-quality solder paste printing. ■ Features of the ER Metal Mask - Resin generation on the mask opening cross-section - Resin generation in specific areas is possible ↓ ■ Effects of resin generation on the printed surface and opening cross-section - Excellent release properties of solder paste - Increased adhesion to PWB, significantly effective in preventing smudging ↓ "Improvement of printing quality" "Increase in productivity with a low defect rate in assembly" For more details, please check the 'Download' section.
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