Solder palette / Flow palette / Masking palette
This is a solder pallet (flow pallet, masking pallet) processed using a super high heat-resistant material called CDM.
Various specifications are available, including micro-machining specifications, parts, specifications with substrate holding functions, bridge killer specifications, adjustable carrier specifications, and specifications with angle adjustment functions.
basic information
This is a solder pallet (flow pallet, masking pallet) processed using a super high heat-resistant material called CDM. - After inserting the components, set them on the carrier. ↓ - Solder will only attach to the opening of the carrier. ↓ - Soldering is complete. ■ Fine Processing Specifications This specification can accommodate cases that require fine processing. ■ Component and Circuit Board Holding Function Specification This specification utilizes spring pins for holding components and circuit boards, which also shortens the setup time for the circuit board. ■ Bridge Killer Specification This is proposed as an item for cases where bridging cannot be resolved. ■ Adjustable Carrier Specification Multiple circuit boards can be set and introduced into the flow layer. This eliminates the need for flow line width adjustments, and the ease of changeover is also a benefit. ■ Angle Adjustment Function Specification This item is designed to provide optimal soldering conditions. It can rotate 360 degrees, allowing for condition setting with a single carrier. For more details, please check the 'Download' section.
Price information
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Delivery Time
Applications/Examples of results
For details, please request through "Request for Materials."
