Dip career
This is a DIP tank transport carrier made using a super high heat-resistant material called CDM.
We offer a variety of specifications, including micro-machining specifications, parts, specifications with substrate holding functions, bridge killer specifications, adjustable carrier specifications, and specifications with angle adjustment functions.
basic information
This is a dip carrier processed using a super high heat-resistant material called CDM. - After inserting the components, set them on the carrier. ↓ - Solder will only adhere to the opening of the carrier. ↓ - Soldering is complete. ■ Fine Processing Specifications This specification can accommodate cases that require fine processing. ■ Component and PCB Holding Function Specification This specification utilizes spring pins for holding components and PCBs, which also shortens the setup time for the PCB. ■ Bridge Killer Specification This is proposed as an item for cases where bridging cannot be resolved. ■ Adjustable Carrier Specification Multiple PCBs can be set and fed into the flow layer. This eliminates the need for flow line width adjustments, which is an advantage for setup changes. ■ Angle Adjustment Function Specification This item is designed to achieve optimal soldering conditions. It can rotate 360 degrees, allowing for condition setting with a single carrier. Please check the details in the 'Download' section.
Price information
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For details, please request through "Request for Materials."
