トーヨーコーポレーション 東京営業部 東京営業3課 Official site

Gala Epoch Carrier

This is a DIP tank transport carrier made using a super high heat-resistant material called CDM.

We offer a variety of specifications, including micro-machining specifications, parts, specifications with substrate holding functions, bridge killer specifications, adjustable carrier specifications, and specifications with angle adjustment functions.

basic information

This is a DIP tank transport carrier processed using a super high heat-resistant material called CDM. - After inserting the components, set them in the carrier. ↓ - Only the opening of the carrier will have solder applied. ↓ - Soldering is complete. ■ Fine Processing Specifications This specification can accommodate cases that require fine processing. ■ Component and PCB Holding Function Specification This specification utilizes spring pins for holding components and PCBs, which also shortens the setup time for the PCB. ■ Bridge Killer Specification This is proposed as an item for cases where bridging cannot be resolved. ■ Adjustable Carrier Specification Multiple PCBs can be set and introduced into the flow layer. This eliminates the need for flow line width adjustments, which is an advantage for setup changes. ■ Angle Adjustment Function Specification This item is designed to provide optimal soldering conditions. It can rotate 360 degrees, allowing for condition setting with a single carrier. For more details, please check the 'Download' section.

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DI-P Tank Transport Carrier Catalog

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