Small Cream Solder Printing Machine TSP-700V
Achieves a line tact of 9 seconds. The clamping performance of the substrate is improved by edge clamping all around the substrate outline. Enhanced cleaning performance. Space-saving design.
The "Compact Cream Solder Printing Machine TSP-700V" is designed with a focus on space-saving and excellent area productivity. Its cleaning capability has also been improved, and by using a TH squeegee, it achieves high filling performance. It can perform high-speed printing at a squeegee speed of 200 mm/s. The automatic arrangement of support pins allows for the automation of the process of raising support pins, achieving zero mistakes. Additionally, data can be created offline in advance (data creation time: approximately 5 minutes). For more details, please download the catalog or contact us.
basic information
【Specifications】 ■Board Size Minimum 50mm*50mm, Maximum 330mm*250mm (OP: 400mm*350mm) ■Applicable Metal Mask Size X650mm*Y550mm, X550mm*Y650mm ■Plate Making Standards Front/Center ■Operating System OS: Windows 7 ■Transport Direction Right→Left, Left→Right (Selectable) ■Transport Reference Front Reference ■Tact Time Approximately 9 seconds (based on our standard board, including printing) ■Squeegee Speed 1 to 300mm/sec ■Printing Accuracy ±0.01mm ■Power Supply Single-phase 200V ■Machine Size W890 (including conveyor 1310mm)*D1400mm*H1375mm (excluding signal tower) For more details, please download the catalog or contact us.
Price information
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Delivery Time
Model number/Brand name
TSP-700V
Applications/Examples of results
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