[Product Introduction] High-frequency device compatible double-sided wiring process formation technology using transparent substrate.
寺田
The "Dual-Sided Wiring Process Formation Technology" is a manufacturing method developed by our company that reduces materials, processes, energy, and waste in conventional methods, contributing to the protection of the global environment through decarbonization. In our country, research and development is progressing towards the full-scale adoption of 5G, which realizes "ultra-high speed," "ultra-low latency," and "mass simultaneous connections." Compared to the current 4G, 5G requires approximately 100 times the communication capacity and necessitates handling electrical signals in the high-frequency range, but increasing frequency comes with the drawback of increased transmission loss. Currently used materials for transmission substrates, such as polyimide resin, have low dielectric properties, and simply improving wiring technology cannot meet the low transmission loss required in the high-frequency range for 5G. Therefore, the use of materials with superior dielectric properties has become a challenge. This new technology makes it possible to not only create antennas for 5G but also to make transparent millimeter-wave radar antennas that are essential for collision avoidance in autonomous driving, significantly easing the restrictions on antenna installation locations. More detailed information is available in related products and catalogs.
