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We have released the specifications sheet for the 2-component, room temperature curing liquid epoxy resin, TE-6420. [TERADITE, room temperature curing, short curing time, high heat resistance, high toughness, low viscosity]
We are currently publishing the specification sheet for our new two-component room temperature curing liquid epoxy resin "TE-6420." It features high toughness and high heat resistance, making it easy …
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Transparent UV-curable polyurethane acrylate TRU-0222 high refractive index product [TDS available].
We will publish materials on transparent UV-curable resins with a refractive index of 1.5 or higher and low viscosity (1,000 mPa·s or lower). For details, please check the materials for "TRU-0222" below. They can be used for optical and other industrial applications.
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We have started handling Huntsman Araldite 2000 series and polyurethane systems.
We apologize for the delay in our announcement on Ipros, but we have started handling HUNTSMAN products since autumn 2022. The products we handle are as follows: - Epoxy-based adhesives Araldite 2000 series (2011, 2012, RAPID, etc.) - Urethane systems (94SB, 160 series, etc.) Please check the product pages below for more details. TDS and SDS are also available for distribution.
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We have started handling heat-resistant 155°C (UL certified) glass cloth adhesive tape. (Materials available upon request)
We have started handling the glass cloth adhesive tape 'H-2715' with a heat resistance of 155℃ (UL certified). It is a relatively inexpensive tape made in South Korea. We have it in stock, so we can accommodate even small quantities. *For details, please refer to the related product page, or feel free to download the materials from below or contact us without hesitation. *The photo is for illustration purposes. Our stock items have a paper core. A plastic core can be discussed, but it is possible to accommodate.
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High-performance epoxy and acrylic resin compound TERADITE catalog has been updated!
High-performance epoxy and acrylic resin compound TERADITE is a compound designed by leveraging our adhesive technology for high-performance resins, manufacturing know-how, and unique synthesis techniques, bringing together our company's expertise. We have updated the comprehensive catalog of developed products and refreshed the product pages. The latest PDF is available on the product page linked below, so please download it from there. https://www.ipros.jp/product/detail/2000583220
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We have published the latest materials for drill and router processing of printed circuit boards.
We have published the latest materials for the drill and router used in substrate processing from Jinzhu Precision, headquartered in Shenzhen, China. For more details, please visit the related product page below or download the materials.
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Epoxy-based two-component adhesive TE-6410 suitable for bonding CFRP and various substrates.
A new type of epoxy-based two-component adhesive TE-6410 has been added (mixing ratio 100:200, usable time 2 hours). Additionally, a comparison table of adhesive strength for various substrates has been newly added. For more details, please refer to the page for the relevant product number below.
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Flexible and high thermal conductivity liquid epoxy resin series (room temperature curing and heat curing)
We have developed a product that imparts flexibility to high thermal conductivity (high heat dissipation) resin. We offer four product variations that cure at room temperature and through heating. For more details, please see the related products below.
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High heat resistance and excellent yellowing resistance transparent epoxy resin! (Property sheet available)
This is a highly transparent resin with a transmittance of over 95%. It excels in heat resistance and yellowing resistance, and will not yellow even under conditions of 120°C for 1,000 hours. There may be slight yellowing at 150°C, but due to its high heat resistance (Tg: over 200°C), it can be used for manufacturing parts that require transparency. Additionally, its mixing viscosity at room temperature is very low at 100 mPa·s, making it easy to handle. For more details, please check the property table in the "Catalog" below.
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High heat-resistant liquid epoxy resin series characteristic table and test data are now available!
Product page: https://www.ipros.jp/product/detail/2001039337 On Ipros' product page, we provide the specifications and heat resistance test data for some part numbers of our high heat-resistant epoxy resin series. Please check the above address or the "Related Products" link below.
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[New Product] 300℃ High Heat Resistant Resin TE-2107
TE-2107 is a heat-curable acrylic resin with high heat resistance. Product page: https://www.ipros.jp/product/detail/2000731003 【Features】 ■ High peel strength ■ High solder heat resistance (over 300°C) ■ High toughness resin ■ Non-silicone, non-fluorine based 【Applications】 ■ Adhesive for bonding sheets for FPC (Flexible Printed Circuit Boards) ■ Components requiring high heat resistance *For more details, please refer to the PDF document or feel free to contact us.
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[Specification Sheet Available] TERADITE Adhesive Series
The TERADITE adhesive series from Terada Corporation is designed primarily for bonding various metals and plastics. We offer 16 types to match different curing methods. While these are made to order, you can purchase small quantities (around a few hundred grams). We can also provide samples, so please feel free to contact us if you are interested. Additionally, customization according to customer requirements is possible. If you wish to customize, please do not hesitate to inquire. ■ Single-component heat-curing epoxy adhesives ⇒ We have 4 types available to match heat resistance and curing conditions. ■ Two-component room temperature curing epoxy adhesives ⇒ We offer 5 types plus 1 type based on bonding strength, curing time, and bonding targets. TE-6010 is a potting resin but has high suitability for bonding bake boards. ■ Anaerobic curing (polyepoxy methacrylate) adhesives ⇒ We have 6 types available in single-component, two-component, and primer-combined types. *For more details, please download the PDF document from below or contact us.
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[Specification sheet available] High transparency epoxy resin. Can be cured by UV or at room temperature.
This is a transparent resin with a very high transparency of over 90%. It has excellent weather resistance, is resistant to yellowing, and is less prone to bubble entrapment. Samples are currently available. It is a highly transparent resin with a transparency of over 90%. It excels in weather resistance, is less prone to yellowing, and can be widely used from crafts to electronic components. We offer both one-component UV-curable and two-component room temperature curing epoxy types. You can download materials from the catalog below.
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[Specification Sheet Available] High Thermal Conductivity Liquid Epoxy Resin Encapsulant
We would like to propose our high thermal conductivity epoxy resin in response to the increasing demand for heat management. We offer products ranging from 1W/mK to 4W/mK. ■TE-7162 1W/mK ■TE-7163 2W/mK ■TE-7125K 3W/mK ■TE-7127 4W/mK A specification sheet is available for distribution. Please download it from the link below.
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Product Introduction: Fluorine-based Release Agent Aerosol 'NOXFREE FS-530A'
The "NOXFREE FS-530A" is an aerosol-type release agent that contains fluorine and silicone components. It is a spray can product that uses liquefied gas as a propellant, making it ready to use and easy to handle. 【Features】 ■ High release properties: Demonstrates excellent release properties in rubber and resin mold forming. ■ High dimensional stability: Contributes to achieving precision molding and reducing defect rates with a thin coating. ■ Low contamination: Minimizes mold contamination, contributing to a reduction in mold cleaning frequency (improving production efficiency). ■ Low transfer: Minimal transfer of release components, preserving the appearance of molded products. ■ Easy application: Can be easily applied to the details of complex mold structures. ■ Easy to handle: No need for a sprayer or concentration adjustment, ready to use immediately. ■ Environmentally friendly: Does not contain PFOS, PFOA, or PFHxA. More details are available in related products and catalogs.
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【Product Introduction】Epoxy Resin & Acrylic Resin 'TERADITE'
"TERADITE" is an epoxy resin and acrylic resin that consolidates technologies cultivated in the electronic device industry, including high-performance resin adhesive technology, manufacturing know-how, and unique synthesis techniques, as well as combined design. It goes beyond conventional epoxy resins to meet various needs, from high thermal conductivity, high heat resistance, and flexibility to environmentally friendly resins and new UV-curable resins. [Features] ■ Consolidation of technologies cultivated in the electronic device industry ■ Responds to various needs, from high thermal conductivity, high heat resistance, and flexibility to environmentally friendly resins and new UV-curable resins More detailed information can be found in related products and catalogs.
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Product Introduction: Various Industrial Adhesive Tapes and Films
We handle a variety of industrial adhesive tapes and films. Starting with the excellent heat and cold resistance of "polyimide adhesive tape," we offer many types including "polyester adhesive tape," which has effective insulation and heat resistance, and "glass cloth adhesive tape." We have a wide range of products available. Additionally, there are items that are in the planning stage for import. 【Product Lineup (Excerpt)】 ■ Polyimide adhesive tape ■ Double-sided tape ■ Polyester adhesive tape ■ Glass cloth adhesive tape ■ Surface protection tape More details are available in related products and catalogs.
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[Product Introduction] High-frequency device compatible double-sided wiring process formation technology using transparent substrate.
The "Dual-Sided Wiring Process Formation Technology" is a manufacturing method developed by our company that reduces materials, processes, energy, and waste in conventional methods, contributing to the protection of the global environment through decarbonization. In our country, research and development is progressing towards the full-scale adoption of 5G, which realizes "ultra-high speed," "ultra-low latency," and "mass simultaneous connections." Compared to the current 4G, 5G requires approximately 100 times the communication capacity and necessitates handling electrical signals in the high-frequency range, but increasing frequency comes with the drawback of increased transmission loss. Currently used materials for transmission substrates, such as polyimide resin, have low dielectric properties, and simply improving wiring technology cannot meet the low transmission loss required in the high-frequency range for 5G. Therefore, the use of materials with superior dielectric properties has become a challenge. This new technology makes it possible to not only create antennas for 5G but also to make transparent millimeter-wave radar antennas that are essential for collision avoidance in autonomous driving, significantly easing the restrictions on antenna installation locations. More detailed information is available in related products and catalogs.