[Specification Sheet Available] High Thermal Conductivity Liquid Epoxy Resin Encapsulant

寺田

We would like to propose our high thermal conductivity epoxy resin in response to the increasing demand for heat management. We offer products ranging from 1W/mK to 4W/mK. ■TE-7162 1W/mK ■TE-7163 2W/mK ■TE-7125K 3W/mK ■TE-7127 4W/mK A specification sheet is available for distribution. Please download it from the link below.

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【TERADITE】High thermal conductivity liquid epoxy resin encapsulant
Proposal of high thermal conductivity resin as a solution to the heating and heat dissipation issues of electronic devices that have become a challenge in recent years. Flexible and room temperature curing products are also available. Specification sheets are currently being presented!

【Lineup】 ■TE-7163 ■TE-7900 ■TE-7127 ■TE-6500 ■TE-7901 ■TE-7170K: 0.9W/m·K (Room temperature curing, flexibility) ■TE-7171: 1.2W/m·K (Heat curing, flexibility) ■TE-7172: 2.2W/m·K (Room temperature curing, flexibility) ■TE-7173: 2.8W/m·K (Heat curing, flexibility) ■TE-7818