【TERADITE】High thermal conductivity liquid epoxy resin encapsulant
Proposal of high thermal conductivity resin as a solution to the heating and heat dissipation issues of electronic devices that have become a challenge in recent years. Flexible and room temperature curing products are also available. Specification sheets are currently being presented!
Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has increased significantly. Our company offers grades of two-component liquid epoxy with thermal conductivity ranging from 1 to 6.5 W/mK. We also have a one-component product with a thermal conductivity of 4 W/mK. *NEW: As of September 6, 2024, we have published the specifications for a new development product with a thermal conductivity of 8.5 W/mK. Currently, we are distributing the specification sheets! For more details, please refer to the PDF download below. Feel free to contact us with any inquiries.
basic information
【Lineup】 ■TE-7163 ■TE-7900 ■TE-7127 ■TE-6500 ■TE-7901 ■TE-7170K: 0.9W/m·K (Room temperature curing, flexibility) ■TE-7171: 1.2W/m·K (Heat curing, flexibility) ■TE-7172: 2.2W/m·K (Room temperature curing, flexibility) ■TE-7173: 2.8W/m·K (Heat curing, flexibility) ■TE-7818
Price range
Delivery Time
Applications/Examples of results
【Application】 ■Potting of electrical and electronic components that require heat dissipation.
