Epoxy & Acrylic Resin TERADITE

Epoxy & Acrylic Resin TERADITE
We are consolidating the technologies cultivated in the electronic device industry, including adhesive technology for high-performance resins, manufacturing know-how, and compound design utilizing our unique synthesis technology.
1~30 item / All 39 items
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High thermal conductivity epoxy resin TE-7163 (2Wm/k)
This is an epoxy resin recommended for heat dissipation and insulation sealing of motors, coils, capacitors, and more. It offers good workability due to its short curing time and low viscosity.
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High thermal conductivity epoxy resin TE-7900 (3Wm/k)
Low viscosity high thermal conductivity epoxy resin. It is ideal for potting electrical and electronic components that require heat dissipation.
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High thermal conductivity epoxy resin TE-7127 (4 W/m·K)
Metal-based fillers are dispersed and blended into epoxy resin to achieve high thermal conductivity. This formulation aims to balance high thermal conductivity with usability.
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General-purpose potting resin TE-3106 low viscosity/high strength product
It is a low viscosity, high strength general-purpose potting resin. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximately 6 to 8 hours).
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General-purpose potting resin TE-7105 flame retardant type
This is a general-purpose epoxy potting resin. It is flame-retardant equivalent to V-0 and has a long usable time of 6 to 8 hours after mixing the two components, making it easy to use.
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General-purpose potting resin TE-7159 thermal conductivity 1W/flame retardant
General-purpose potting resin with flame retardancy (equivalent to UL94 V-0) and thermal conductivity (1.0 W/mK). It is a high-strength, crack-resistant epoxy resin.
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General-purpose potting resin TE-7017, high thixotropy, low elasticity modulus product.
The general-purpose potting resin is endowed with high thixotropy and low elasticity. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximately 6 to 8 hours).
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General-purpose potting resin E-1 low elasticity/room temperature curing type
This is a general-purpose potting resin that can be used for a wide range of electrical and electronic components. It can cure at room temperature through amine curing.
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General-purpose potting resin TE-6010 low viscosity/flame retardant type
This is a low-viscosity general-purpose potting resin equivalent to flame retardant UL94 V-0, environmentally friendly. It can cure at room temperature through amine curing.
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General-purpose potting resin TE-6302 low viscosity/high strength product
It is a two-component epoxy resin that cures at room temperature, has high bending strength (high strength), and low viscosity.
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Teradite Release Agent MO-7
This is a release agent that can be widely used for resin molds, casting molds, and metal molds.
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Thermal Conductive Flexible Resin TE-8008
This is a flexible epoxy resin of a two-component mixed type with thermal conductivity. It has a thermal conductivity of 1.1 W/mK, flame retardancy equivalent to V-0, and is characterized by crack resistance.
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Universal Type One-Part Adhesive TX-2610-2
It is a general-purpose one-component epoxy adhesive. Compared to the same general-purpose type TE-5014, it has a shorter heating time and lower heating temperature.
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General-purpose two-component adhesive TE-1002 (room temperature curing)
Two-component epoxy adhesive. Cures at room temperature. Can be used not only as an adhesive but also as a sealant.
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High-adhesion type two-component adhesive TE-1003
Two-component epoxy adhesive. Cures at room temperature. This type has enhanced adhesive strength. It can be used not only as an adhesive but also as a sealant.
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High-adhesion type two-component adhesive TE-1004 (room temperature curing)
Two-component epoxy adhesive. Cures at room temperature. Exhibits high performance for bonding engineering plastics.
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Fast-curing type two-component adhesive TE-1005
Two-component epoxy adhesive. Curing time is shortened, and it can cure in 6 hours at room temperature. Please use it as an adhesive or sealant.
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UV-curable resin, high strength type TRU-0212
It is a radical-type UV-curable resin. Because it has been given anaerobic and heat-curing properties, it is possible to cure the resin even inside where light does not reach.
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Low viscosity UV-curable resin TRU-0201K
It is a radical-type UV-curable resin. It has anaerobic and heat-curing properties. It is a low-viscosity type.
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UV-curable resin, flexible type TRU-0202
It is a radical-type UV-curable resin. It has been given anaerobic and heat-curing properties. It is flexible and effective in preventing cracks.
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UV-curable resin, high glass transition temperature type TRU-0251
It is a cationic UV-curable resin. It has a Tg of 150°C and excellent heat resistance.
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UV-curable resin, high thixotropic type TRU-0250K
Cationic UV-curable resin, providing high thixotropy.
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Room temperature short-term curing epoxy resin TE-6011K
A two-component epoxy resin that cures in 4 hours at room temperature! The reduction in curing time leads to cost savings.
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【TERADITE】High thermal conductivity liquid epoxy resin encapsulant
Proposal of high thermal conductivity resin as a solution to the heating and heat dissipation issues of electronic devices that have become a challenge in recent years. Flexible and room temperature curing products are also available. Specification sheets are currently being presented!
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Phenolic conductive paint TE-9800
This is a phenolic conductive paint that can be used for electromagnetic wave shielding.
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Inspection jigs and model epoxy resin Teradite
These are epoxy resin products that can be used for inspection jigs and models. They include gel coats, backing, casting, laminating, workable resins, release agents, and more.
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[Specification Sheet Available] TERADITE Adhesive Series
We offer one-component heat-curing types, two-component room temperature curing types, and anaerobic curing types. Samples are also available.
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300℃ High Heat Resistant Resin TE-2107
It is a heat-curing acrylic resin with high solder heat resistance of over 300℃.
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High-performance adhesive (for CFRP, etc.) Two-component adhesive TE-6410
Two-component epoxy adhesive. Cures at room temperature. Recommended for bonding various substrates such as CFRP. Available in two types with working times of 2 hours and 4 hours.
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High heat-resistant liquid epoxy resin series - offering property tables and test data!
We offer a wide range of liquid epoxy resin encapsulants with a maximum Tg (glass transition temperature) of 308°C under our own brand, TERADITE.
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