High transparency, high flexibility, room temperature curing epoxy resin TE-6408BL6

This is a two-component, room temperature curing liquid epoxy resin with very high transparency of over 95% transmittance and high flexibility of Shore A 60.

last updated Mar 13, 2025

High heat resistance and high thermal conductivity (heat dissipation) liquid epoxy resin series

For potting in motors! High heat-resistant liquid epoxy resin with a Tg of up to 300°C and high thermal conductivity liquid epoxy resin with a maximum of 6.5 W/m·K.

last updated Feb 16, 2025

Flexible and high thermal conductivity liquid epoxy resin series (room temperature curing and heat curing)

Flexible high thermal conductivity (high thermal conductivity) resin with thermal conductivity ranging from 0.9 to 2.8 W/m·K! We have a lineup of four products available for room temperature curing and heat curing!

last updated Sep 24, 2024

High-performance epoxy and acrylic resin compound TERADITE

Our in-house brand: TERADITE has limitless applications for encapsulation, molding, and adhesion of electrical and electronic components! We can meet a variety of needs!

last updated Aug 16, 2024

[Newly Developed Product!] Room Temperature Curing Liquid Epoxy Resin TE-6420

This is a two-component, room temperature curing liquid epoxy resin for new product development. It has high toughness and high heat resistance, making it easy to use with room temperature short curing times. [Properties table available!]

last updated Oct 16, 2025

Epoxy-based adhesive TE-1002FR (high adhesion strength, flame retardant)

【New development product number!】This is an epoxy-based adhesive with a shear adhesive strength of 32 MPa between SUS materials and equivalent to UL94 5mm V-0!

last updated Oct 16, 2025

[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

This is a one-component heat-curing epoxy resin for new product development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

last updated Oct 16, 2025

[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

This is a one-component heat-curing and UV-curing epoxy resin for new development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

last updated Oct 16, 2025

[New Development] Two-Component Room Temperature Curing Epoxy Resin TE-7172K2

This is a two-component, room temperature curing epoxy resin for new product development. It has high thermal conductivity and flexibility. [Property table available]

last updated Aug 08, 2025

[New Development] Two-Component Room Temperature Curing Epoxy Resin TE-7172K3

Room temperature curing × High thermal conductivity 3.3W/mK × Flexibility! An epoxy resin suitable for stress relief. Ideal for gap filler applications, flame retardant equivalent to V-0.

last updated Jan 05, 2026

Newly Developed Product: Two-Component Room Temperature Curing Epoxy Resin TE-6430

Room temperature curing type × high thermal conductivity 2.4W/mK! A two-component epoxy resin with excellent heat dissipation insulation. Suitable for thermal management of motors, coils, and sensors.

last updated Oct 22, 2025

New Development Product: Two-Component Heat-Curing Epoxy Resin TE-7814V

High thermal conductivity of 2.5 W/mK and high Tg of 185°C, this is a highly reliable low-viscosity epoxy resin suitable for thermal management of motors and coils.

last updated Oct 22, 2025

Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-7820FR3

High Tg × Flame Retardant V-0 × Improved Copper Adhesion! Suitable for Power Device Encapsulation.

last updated Oct 22, 2025

[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

General-purpose epoxy resin for encapsulating electrical and electronic components. Suitable for encapsulating motors, coils, and more.

last updated Oct 22, 2025

[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

Fills in detail with low viscosity! A highly reliable epoxy resin that can also be considered as a varnish alternative. Flexible response to work plans with a usable time of 24 hours.

last updated Oct 22, 2025

Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-6000

Low viscosity for thorough filling of details! An epoxy resin that can also be considered as a varnish alternative. Cures at room temperature and contributes to energy savings.

last updated Oct 22, 2025

[New Development] Two-component Room Temperature Curing Epoxy Resin TE-6420FR

Room temperature curing × high heat resistance × flame retardant V-0 equivalent! Epoxy resin for sealing electrical and electronic components. No heating equipment required! Contributes to energy savings with room temperature curing type.

last updated Oct 22, 2025

[New Development] Two-component Heat-Curing Epoxy Resin TE-6409FR

Transparent, difficult to yellow, flame-retardant epoxy resin equivalent to V-0. Low viscosity with excellent workability. Widely usable from transparent sealing to clear panels.

last updated Oct 22, 2025

Newly Developed Product: Two-Component Room Temperature Curing Epoxy Resin TE-7170K

Room temperature curing × high thermal conductivity × flexibility! An epoxy resin suitable for stress relief. Low viscosity and good workability, equivalent to UL94 V-0.

last updated Oct 22, 2025

[New Development] Two-component Room Temperature Curing Epoxy Resin TE-6408FRK

Room temperature curing × high transparency × flame retardant equivalent to V-0 epoxy resin. Flexibility enhancement to suppress cracking! A new proposal for room temperature curing epoxy.

last updated Oct 22, 2025

[New Development] One-component Heat-Curing Epoxy Resin TE-5018

One-component × low-temperature curing × high insulation! Epoxy resin for encapsulating electronic components. Cures completely at 80°C in 1 hour! Low-temperature curing type enhances work efficiency.

last updated Oct 22, 2025

[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-5014K4

One-component × high strength × high thixotropy! An epoxy resin suitable for structural bonding. With a Tg of 130°C and a shear adhesive strength of 24 MPa, it is a highly reliable structural adhesive.

last updated Oct 22, 2025

[New Development] Two-component Room Temperature Curing Epoxy Resin TE-1006-2

Room temperature curing × high adhesion × high moisture resistance! Epoxy resin for small motors and sensors. Cures at room temperature, energy-saving high-performance epoxy.

last updated Oct 22, 2025

Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

UV-curable epoxy acrylate that balances transparency and high strength. Suitable for applications requiring reliability equivalent to UL94 V-0.

last updated Oct 22, 2025

[Newly Developed Product] UV-Curable Epoxy Resin TRU-0251FR

Easy to handle with one-component UV curing, high Tg epoxy resin equivalent to flame retardant V-0. Low viscosity of 1,300 mPa·s allows for penetration into fine details, ensuring reliable protection of electronic components.

last updated Oct 22, 2025

[Newly Developed Product] UV-Curable Epoxy Acrylate TRU-0153K

UV-curable urethane acrylate that balances transparency and durability. It has low viscosity and low hardness, providing flexibility and is effective for stress relief.

last updated Oct 22, 2025

Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0500K2

One-component UV-curable urethane acrylate resin. Suitable for substrate coating. Excellent workability with low viscosity of 550 mPa·s and quick curing for mass production.

last updated Oct 22, 2025

[New Development Product] UV-Curable Epoxy Resin TRU-0260K2

One-component UV-curable epoxy resin - Suitable for balancer applications in small motors due to its high density.

last updated Oct 22, 2025

[Newly Developed Product] One-component Polyepoxy Acrylate Resin

High-performance UV resin that balances high Tg, LED curing, and transparency.

last updated Dec 12, 2025

TE-7172K3 for electronic devices: Balancing insulation and heat dissipation.

Insulating epoxy resin with room temperature curing, high thermal conductivity, and flexibility.

last updated Jan 05, 2026