Epoxy & Acrylic Resin TERADITE
Epoxy & Acrylic Resin TERADITE
We are consolidating the technologies cultivated in the electronic device industry, including adhesive technology for high-performance resins, manufacturing know-how, and compound design utilizing our unique synthesis technology.
61～84 item / All 84 items
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UV-curable epoxy resin "TERADITE TRU-0260K3"
Curing conditions are UV (metal halide lamp) 6,000 mJ/cm²! High heat resistance, high humidity resistance resin.
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Room temperature curing epoxy resin 'TERADITE TE-7172K4'
Flame retardant UL94 equivalent to V-2 at 3mm! The main component is epoxy resin, and the hardener is amine.
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TERADITE TE-7172K4 for automobiles
Flame retardant, high thermal conductivity, and flexible epoxy resin.
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High Thermal Conductivity Epoxy Resin for Semiconductors TE-7163
For heat dissipation and insulation sealing of semiconductor devices. Excellent workability with quick curing and low viscosity.
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High Thermal Conductivity Epoxy Resin TE-7163 for Automotive Applications
For automotive cooling systems. This epoxy resin is ideal for heat dissipation and insulation sealing.
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High Thermal Conductivity Epoxy Resin TE-7900 for Semiconductors
Epoxy resin that enhances heat dissipation and improves the reliability of semiconductor devices.
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High Thermal Conductivity Epoxy Resin TE-7900 for Automotive Applications
Low viscosity, high thermal conductivity epoxy resin that contributes to improving the cooling performance of automobiles.
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High Thermal Dissipation Epoxy TE-7900 for Power Electronics
It enhances heat dissipation and contributes to the efficiency of power electronics.
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High Thermal Conductivity Epoxy Resin TE-7900 for Robotics
Low-viscosity epoxy resin that solves the heat dissipation problem of high-output robots.
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High thermal conductivity epoxy resin for semiconductors TE-7127
Achieving both high thermal conductivity and ease of use. We solve the heat dissipation challenges of semiconductors.
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High Thermal Conductivity Epoxy Resin TE-7127 for Automotive Applications
High thermal conductivity epoxy resin contributing to the improvement of automotive cooling performance.
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TE-7127 for industrial robots
Achieves both high thermal conductivity and ease of use. Contributes to the performance improvement of industrial robots.
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Two-component room temperature curing epoxy resin TE-6430 for automotive use
Room temperature curing type × high thermal conductivity! Contributing to the bonding of automotive parts.
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Two-component room temperature curing epoxy resin TE-6430 for electronic devices
Room temperature curing type × high thermal conductivity! Epoxy resin excellent in heat dissipation insulation.
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Two-component heat-curing epoxy resin for automotive use TE-7814V
High thermal conductivity 2.5 W/mK × high Tg 185°C high-reliability low-viscosity epoxy resin
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Two-component heat-curing epoxy resin for electronic devices TE-7814V
High thermal conductivity 2.5W/mK × high Tg 185°C high-reliability low-viscosity epoxy resin
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TE-7814V for semiconductor packaging
Improving the reliability of semiconductor devices with high thermal conductivity and high Tg.
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High Durability Epoxy Resin for Home Appliances TE-7814V
Achieving long-term reliability of home appliances with high thermal conductivity and high Tg.
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TE-7814V for Robot Precision Equipment
Improving the reliability of robotic precision equipment with high thermal conductivity and high Tg.
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High-reliability epoxy resin TE-7814V for communication equipment
Contributes to stable operation of communication devices with high thermal conductivity and high Tg.
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TE-7820FR3 for electronic devices
High Tg, flame retardant, improved copper adhesion! Enhancing the reliability of small electronic devices.
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TE-7820FR3 for semiconductors
High Tg, flame retardant, improved copper adhesion! Ideal for power device encapsulation.
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Two-component heat-curing epoxy resin for home appliances TE-7820FR3
High Tg and flame retardant to improve the safety of electrical appliances.
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Two-component heat-curing epoxy for robots TE-7820FR3
Contributes to improving the durability of robots with high Tg, flame resistance, and copper adhesion.
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