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Flexible and high thermal conductivity liquid epoxy resin series (room temperature curing and heat curing)

寺田

寺田

We have developed a product that imparts flexibility to high thermal conductivity (high heat dissipation) resin. We offer four product variations that cure at room temperature and through heating. For more details, please see the related products below.

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  • Flexible and high thermal conductivity liquid epoxy resin series (room temperature curing and heat curing)

    Flexible high thermal conductivity (high thermal conductivity) resin with thermal conductivity ranging from 0.9 to 2.8 W/m·K! We have a lineup of four products available for room temperature curing and heat curing!

    Lineup ■TE-717K: 0.9W/m·K, room temperature curing, flexibility ■TE-7171: 1/2W/m·K, heat curing, flexibility ■TE-7172K: 1.5W/m·K, room temperature curing, flexibility ■TE-7173: 2.8W/m·K, heat curing, flexibility

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