Flexible and high thermal conductivity liquid epoxy resin series (room temperature curing and heat curing)
Flexible high thermal conductivity (high thermal conductivity) resin with thermal conductivity ranging from 0.9 to 2.8 W/m·K! We have a lineup of four products available for room temperature curing and heat curing!
In recent years, with the miniaturization and high integration of components, there has been a demand for thermally conductive epoxy resins as insulating materials, and stress relief has also become necessary. In response to this need, we have developed a flexible thermal conductive resin series. This product series features low viscosity for ease of use and has thermal conductivity ranging from 0.9 to 2.8 W/m·K. In addition to the conventional heat-curing type, we also offer an environmentally friendly room-temperature curing type. Both types are two-component systems. We also have products that are non-flexible but offer higher thermal conductivity. For more details, please download the PDF "Introduction to TERADITE [Updated on 2024/8/1]" from the link below or check the product page. https://www.ipros.jp/product/detail/2001118658 *For product details, please download the PDF from the link below or feel free to contact us. *On 2024/8/1, the PDF for TE-7172 was replaced with the improved model number TE-7172K. *On 2024/9/24, the PDF for TE-7170 was replaced with the improved model number TE-7170K.
basic information
Lineup ■TE-717K: 0.9W/m·K, room temperature curing, flexibility ■TE-7171: 1/2W/m·K, heat curing, flexibility ■TE-7172K: 1.5W/m·K, room temperature curing, flexibility ■TE-7173: 2.8W/m·K, heat curing, flexibility
Price range
Delivery Time
Applications/Examples of results
Heat dissipation components that require stress relaxation, such as motors, reactors, electronic substrates, and batteries.
