[New Development] Two-component Room Temperature Curing Epoxy Resin TE-1006-2

Room temperature curing × high adhesion × high moisture resistance! Epoxy resin for small motors and sensors. Cures at room temperature, energy-saving high-performance epoxy.

last updated Oct 22, 2025

[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-5014K4

One-component × high strength × high thixotropy! An epoxy resin suitable for structural bonding. With a Tg of 130°C and a shear adhesive strength of 24 MPa, it is a highly reliable structural adhesive.

last updated Oct 22, 2025

[New Development] One-component Heat-Curing Epoxy Resin TE-5018

One-component × low-temperature curing × high insulation! Epoxy resin for encapsulating electronic components. Cures completely at 80°C in 1 hour! Low-temperature curing type enhances work efficiency.

last updated Oct 22, 2025

[New Development] Two-component Room Temperature Curing Epoxy Resin TE-6408FRK

Room temperature curing × high transparency × flame retardant equivalent to V-0 epoxy resin. Flexibility enhancement to suppress cracking! A new proposal for room temperature curing epoxy.

last updated Oct 22, 2025

Newly Developed Product: Two-Component Room Temperature Curing Epoxy Resin TE-7170K

Room temperature curing × high thermal conductivity × flexibility! An epoxy resin suitable for stress relief. Low viscosity and good workability, equivalent to UL94 V-0.

last updated Oct 22, 2025

[New Development] Two-component Heat-Curing Epoxy Resin TE-6409FR

Transparent, difficult to yellow, flame-retardant epoxy resin equivalent to V-0. Low viscosity with excellent workability. Widely usable from transparent sealing to clear panels.

last updated Oct 22, 2025

[New Development] Two-component Room Temperature Curing Epoxy Resin TE-6420FR

Room temperature curing × high heat resistance × flame retardant V-0 equivalent! Epoxy resin for sealing electrical and electronic components. No heating equipment required! Contributes to energy savings with room temperature curing type.

last updated Oct 22, 2025

Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-6000

Low viscosity for thorough filling of details! An epoxy resin that can also be considered as a varnish alternative. Cures at room temperature and contributes to energy savings.

last updated Oct 22, 2025

[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

Fills in detail with low viscosity! A highly reliable epoxy resin that can also be considered as a varnish alternative. Flexible response to work plans with a usable time of 24 hours.

last updated Oct 22, 2025

[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

General-purpose epoxy resin for encapsulating electrical and electronic components. Suitable for encapsulating motors, coils, and more.

last updated Oct 22, 2025

Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-7820FR3

High Tg × Flame Retardant V-0 × Improved Copper Adhesion! Suitable for Power Device Encapsulation.

last updated Oct 22, 2025

New Development Product: Two-Component Heat-Curing Epoxy Resin TE-7814V

High thermal conductivity of 2.5 W/mK and high Tg of 185°C, this is a highly reliable low-viscosity epoxy resin suitable for thermal management of motors and coils.

last updated Oct 22, 2025

Newly Developed Product: Two-Component Room Temperature Curing Epoxy Resin TE-6430

Room temperature curing type × high thermal conductivity 2.4W/mK! A two-component epoxy resin with excellent heat dissipation insulation. Suitable for thermal management of motors, coils, and sensors.

last updated Oct 22, 2025

[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-7901K

One-component × High thermal conductivity 6.5W/mK! Epoxy resin for heat dissipation insulation. Suitable for encapsulating components that require thermal management, such as motors and power devices.

last updated Oct 22, 2025

[New Development] Two-Component Room Temperature Curing Epoxy Resin TE-7172K3

Room temperature curing × High thermal conductivity 3.3W/mK × Flexibility! An epoxy resin suitable for stress relief. Ideal for gap filler applications, flame retardant equivalent to V-0.

last updated Jan 05, 2026

[New Development] Two-Component Room Temperature Curing Epoxy Resin TE-7172K2

This is a two-component, room temperature curing epoxy resin for new product development. It has high thermal conductivity and flexibility. [Property table available]

last updated Aug 08, 2025

[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

This is a one-component heat-curing and UV-curing epoxy resin for new development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

last updated Oct 16, 2025

[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

This is a one-component heat-curing epoxy resin for new product development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

last updated Oct 16, 2025

Epoxy-based adhesive TE-1002FR (high adhesion strength, flame retardant)

【New development product number!】This is an epoxy-based adhesive with a shear adhesive strength of 32 MPa between SUS materials and equivalent to UL94 5mm V-0!

last updated Oct 16, 2025

[Newly Developed Product!] Room Temperature Curing Liquid Epoxy Resin TE-6420

This is a two-component, room temperature curing liquid epoxy resin for new product development. It has high toughness and high heat resistance, making it easy to use with room temperature short curing times. [Properties table available!]

last updated Oct 16, 2025

Araldite Urethane 160FL

Huntsman manufactured solvent-containing one-component urethane-based moisture-proof coating for printed circuit boards. In stock at our company.

last updated Dec 09, 2024

Araldite Urethane 160BP-TF

Huntsman-made solvent-containing one-component urethane-based moisture-proof coating for printed circuit boards. In stock at our company.

last updated Dec 09, 2024

Araldite Urethane 160TF

Huntsman manufactured solvent-containing one-component urethane-based moisture-proof coating for printed circuit boards. In stock at our company.

last updated Dec 09, 2024

Araldite Urethane 160B-N

Huntsman-made solvent-containing one-component urethane-based moisture-proof coating for printed circuit boards. In stock at our company.

last updated Dec 09, 2024

Epoxy-based adhesive Araldite 420AB (TDS and SDS available)

Two-component epoxy adhesive made by Huntsman. It has high strength and elasticity, allowing it to bond various materials, but it is particularly recommended for bonding CFRP and GFRP.

last updated Dec 09, 2024

Epoxy adhesive Araldite RAPID

Huntsman-made rapid curing type two-component epoxy adhesive. Initial strength develops in about 20 minutes at room temperature. Tube-filled product. TDS and SDS are available for distribution.

last updated Mar 13, 2025

Araldite Urethane 160

Huntsman-made solvent-containing one-component urethane-based moisture-proof coating for printed circuit boards. In stock at our company.

last updated Dec 09, 2024

Araldite AW2101/HW2951 (TDS/SDS available)

This is a two-component epoxy quick-setting adhesive from Huntsman Corporation. It cures rapidly at room temperature and can fill gaps.

last updated Mar 10, 2025

Epoxy-based adhesive Araldite 2020 (TDS and SDS available)

Huntsman’s two-component epoxy adhesive. A low-viscosity, transparent adhesive with a low refractive index. Recommended for bonding glass and ceramics, transparent casting, and laminating.

last updated Dec 09, 2024

Epoxy adhesive Araldite AV138M-1/HV998-1

This is a two-component epoxy adhesive from Huntsman. It has excellent heat resistance and chemical resistance, withstanding temperatures up to 140°C. Thixotropic. TDS and SDS are available for distribution.

last updated Dec 09, 2024