[On-Demand Seminar] A Must-See for Finished Product Manufacturers! About Solder Limits and Thermal Stress Testing of Printed Circuit Boards
UL Japan
Free | About 10 minutes The UL standards for printed circuit boards have been revised, and a standardized reflow profile (temperature/time intended for surface mounting) for solder limits has been introduced. The UL certification for printed circuit boards is a conditional certification, and the solder limit is one of the important certification conditions for printed circuit boards. This presentation will briefly explain the background of the introduction of the standardized reflow profile and future responses for those obtaining certification for printed circuit boards and those using printed circuit boards in final products.
- Date and time Always open
- Entry fee Free