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Joining and film formation

石原ケミカル

石原ケミカル 高機能材料

We offer "joining and film formation" utilizing high-performance materials. We can handle various processes, including "hermetic joining using glass paste," "direct brazing without metallization," and "creation of electrolytic cells with stacked powder catalysts and metal pastes." We can accommodate prototype development starting from one piece, so please feel free to contact us when you need assistance. You can find more details in related products and catalogs.

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  • "Support for prototype development from one piece" Application of joining and film formation.

    Can be used in high-temperature environments, utilizing high-performance materials!

    【Characteristics of Film Formation】 <Using plating and screen printing to create electrode films on insulating materials> ■ Partial film formation, high-temperature use, and small quantity support are possible ■ Outgassing <Fluorine coating protective film that does not scratch the substrate> ■ Film formation regardless of material type and partial film formation are possible, with anti-static measures <Creation of electrolytic cells stacked with powder catalysts or metal pastes> ■ High-temperature (1300°C) sintering is possible, accommodating various substrates (ceramics, resins) ■ Small quantity support is possible *For more details, please refer to the PDF document or feel free to contact us.

Related catalog

Collection of applications for joining and film formation using high-performance materials.

TECHNICAL

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