We will be exhibiting at the 2021 International Powder Technology Exhibition Osaka from October 13 (Wednesday) to October 15 (Friday), 2021.
ユーシー・ジャパン
This time, UC Japan will be exhibiting at the "2021 International Powder Technology Exhibition Osaka," which will be held for three days from October 13 (Wednesday) to 15 (Friday) at Intex Osaka (Halls 4 and 5). At our booth, we will mainly introduce the "Ultrasonic Sieve Unit." This product transmits special ultrasonic vibrations to each individual stainless steel mesh wire, resolving issues such as clogging, adhesion, agglomeration, and bridging in sieves and hoppers. ■ Booth Number: 5-B01 We sincerely look forward to your visit.
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Date and time Wednesday, Oct 13, 2021 ～ Friday, Oct 15, 2021
10:00 AM ～ 05:00 PM
The last day is until 4:30 PM. - Capital ■Venue: Intex Osaka, Nanko ■Address: 1-5-102 Nanko Kita, Suminoe-ku, Osaka-shi, Osaka 559-0034 ■Nearest Stations - Approximately 9 minutes on foot from Cosmo Square Station - Approximately 8 minutes on foot from Trade Center-mae Station - Approximately 5 minutes on foot from Naka-Futo Station ■Booth Number: 5-B01
- Entry fee Free If you do not bring an invitation ticket or register in advance via the web, the admission fee is ¥1,000 per person.
