Product Categories
-
What is sweep vibration?
-
Cleaning system
-
Ultrasound hand unit
-
Medical application
-
Ultrasonic sealer/ultrasonic cutter
-
Ultrasonic horn
-
Ultrasonic set for automatic machines (OEM)
-
Ultrasonic Plastic Welding Machine Set
-
◆RINCO's Products◆
-
◆UC Products◆
-
New type ultrasonic sieve machine
-
Ultrasonic mesh cleaning / Ultrasonic hopper
-
Ultrasonic Vibrator DGS Type
-
Ultrasonic oscillator PNS type
-
◆Artec Products◆
-
Ultrasonic Metal Welding Machine
-
Ultrasonic oscillator
-
Ultrasonic transducer
Featured products
Products/Services(58items)
news list
-
Notice of Participation in the "Secondary Battery Exhibition" from March 15 (Wednesday) to March 17 (Friday), 2023.
Our company will be exhibiting at the "Secondary Battery Exhibition" held at Tokyo Big Sight. This exhibition showcases various technologies, components, materials, and equipment necessary for the research, development, and manufacturing of secondary batteries, attracting experts from around the world. At UC Japan, we plan to exhibit our high-precision, high-rigidity servo press, the "Ultrasonic Metal Welder (USDB20kHz/35kHz)," which is focused on processing reproducibility. This product features servo load and ultrasonic control that can minimize plastic deformation during aluminum material joining, making it suitable for busbar joining, wire harnesses, terminal joining, splicers, and coil terminal joining, adapting to the recent trend of aluminum use. We sincerely look forward to your visit.
-
We will be exhibiting at the 2022 International Powder Technology Exhibition Tokyo from December 7 (Wednesday) to December 9 (Friday).
UC Japan will be exhibiting at the "2022 International Powder Technology Exhibition Tokyo" held at Tokyo Big Sight (Halls 1, 2, and 3) from December 7 (Wednesday) to December 9 (Friday), 2022. At our booth, we will primarily introduce the "Ultrasonic Sieve Unit." This product transmits special ultrasonic vibrations through each individual stainless steel mesh wire to resolve issues such as clogging, adhesion, agglomeration, and bridging in sieves and hoppers. ■ Booth number: To be updated regularly. We sincerely look forward to your visit.
-
We will be exhibiting at the 2021 International Powder Technology Exhibition Osaka from October 13 (Wednesday) to October 15 (Friday), 2021.
This time, UC Japan will be exhibiting at the "2021 International Powder Technology Exhibition Osaka," which will be held for three days from October 13 (Wednesday) to 15 (Friday) at Intex Osaka (Halls 4 and 5). At our booth, we will mainly introduce the "Ultrasonic Sieve Unit." This product transmits special ultrasonic vibrations to each individual stainless steel mesh wire, resolving issues such as clogging, adhesion, agglomeration, and bridging in sieves and hoppers. ■ Booth Number: 5-B01 We sincerely look forward to your visit.
-
Notice of participation in Smart Energy Week 2020 "11th [International] Secondary Battery Exhibition" from February 26 (Wednesday) to February 28 (Friday), 2020.
This time, UC Japan will be exhibiting at the Smart Energy Week 2020, held at Tokyo Big Sight from February 26 (Wednesday) to February 28 (Friday), for three days, at the 11th International Secondary Battery Exhibition. At our booth, we will showcase our newly developed and improved production-capacity type "New Metal Joining Device," based on our extensive track record. We look forward to introducing our new products and technologies. We sincerely await your visit.
-
Notice of Participation in the 10th [International] Secondary Battery Expo - Battery Japan
We are pleased to announce that UC Japan will be exhibiting at the "10th [International] Secondary Battery Expo - Battery Japan," which will be held at Tokyo Big Sight from February 27, 2019. *We sincerely look forward to your visit.

Aboutユーシー・ジャパン
Creating the future with ultrasonic technology! Ultrasonic metal joining, ultrasonic powder screening, ultrasonic plastic welding, ultrasonic cutting—feel free to consult us about anything.
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.