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Fine powder classification for improving gloss in coatings.

Efficient classification of fine powders that influence the gloss of coatings using ultrasound.

In the paint industry, uniformity of gloss, which affects the finish of products, is required. To achieve gloss, it is important to precisely control the particle size distribution of the pigments and additives contained in the paint. Variations in particle size distribution can lead to uneven gloss and deterioration of the finish. The Artech ultrasonic sifter efficiently classifies fine powders, contributing to the improvement of paint quality. [Usage Scenarios] - Classification of pigments and additives in paint manufacturing - Paint products that want to improve glossiness - Particle size measurement in paint quality control [Effects of Implementation] - Improved gloss uniformity - Enhanced paint quality - Increased efficiency of work time

Artech Ultrasonic Sieve Machine / Ultrasonic Hopper / UC Japan Co., Ltd.

basic information

【Features】 - Capable of high mesh dry classification below 50µm - Easily attachable to existing JIS test sieve frames - Suppresses mesh clogging - Proven performance in dry particle size classification at 20μm level and wet slurry classification in micrometers - Explosion-proof specifications (compliant with ATEX ZONE 22) 【Our Strengths】 UC Technology has cultivated ultrasonic technology for many years. We provide optimal solutions tailored to our customers' challenges, offering a wide range of support including experimental assistance, demo equipment loans, and ultrasonic consulting.

Price information

The price varies depending on the equipment specifications, so please feel free to contact us.

Delivery Time

Model number/Brand name

Artech ultrasonic sieve/ultrasonic hopper/ultrasonic quantitative discharge technology

Applications/Examples of results

【Applications】 ■ Battery materials ■ Coatings ■ Metal materials ■ Resin materials ■ Pharmaceutical materials / Food materials ■ Toner ■ Chemical products   etc. * For more details, please refer to the PDF document or feel free to contact us.

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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.