Shape classification using ultrasonic sieving for metal powders.
Achieving shape sorting of high-quality metal powders using ultrasonic technology.
In the metal powder industry, shape classification, which affects product quality, is crucial. Contamination and shape defects can lead to decreased product performance and worsened yield. Particularly in fields such as battery materials, precise classification of fine powders is required. The Artech ultrasonic sieve facilitates high-mesh dry classification below 50µm, enabling shape classification of high-quality metal powders. This is expected to lead to improved product quality and significant enhancements in work efficiency. 【Application Scenarios】 - Shape classification of powders in battery material manufacturing - Classification of powders for metal 3D printers - Adjustment of particle size for abrasives 【Benefits of Implementation】 - Stable supply of high-quality products - Improved yield - Reduced working time - Extended mesh lifespan
basic information
【Features】 - Capable of high-mesh dry classification below 50µm - Can be retrofitted to JIS test sieve frames - Suppresses mesh clogging - Proven results in dry particle size classification at 20μm level and wet slurry classification in micrometers - Explosion-proof specification (compliant with ATEX ZONE 22) 【Our Strengths】 UC Technology has been a leader in ultrasonic technology since 1966. We value experimental verification with our customers and propose ultrasonic solutions necessary for creating the future of manufacturing. We have a wide range of support systems in place, from experimental assistance and demo equipment loans to ultrasonic consulting.
Price information
The price varies depending on the equipment specifications, so please feel free to contact us.
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Model number/Brand name
Artech ultrasonic sieve/ultrasonic hopper/ultrasonic quantitative discharge technology
Applications/Examples of results
【Applications】 ■ Battery materials ■ Coatings ■ Metal materials ■ Resin materials ■ Pharmaceutical materials / Food materials ■ Toner ■ Chemical products etc. * For more details, please refer to the PDF document or feel free to contact us.
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Line up（1）
| Model number | overview |
|---|---|
| DGS35kHz | Ultrasonic oscillator 35kHz frequency 50W/100W/200W |
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.