Ultrasonic transducer for Uthe company's wire bonder.
Ultrasonic metal bonding wire bonder, flip chip bonder
Transducer for Ball Bonders ■〈ST Type Transducer〉 The ST type ultrasonic transducer is a standard ultrasonic transducer for ball bonders that Uthe Technology has been supplying stably for many years. ■〈ST-LE Type Transducer〉 The ST-LE type transducer is an ultrasonic transducer that enables fine-pitch wire bonding, which has become particularly important in recent years. ■〈B Type Transducer〉 The latest ultrasonic transducer for ball bonders, confidently delivered by Uthe Technology. 〈ST Type Transducer〉 ■〈PT Type Transducer〉 The PT type ultrasonic transducer is a standard ultrasonic transducer for wedge bonders that Uthe Technology has been supplying stably for many years. ■〈PT-LE Type Transducer〉 The PT-LE type ultrasonic transducer is an ultrasonic transducer that enables fine-pitch wire bonding, which has become particularly important in recent years. ■〈W Type Transducer〉 The latest ultrasonic transducer for wedge bonders, confidently delivered by Uthe Technology.
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.