Ultrasonic transducer for Uthe company's wire bonder.
Over the past 30 years, there has been a proven track record of being installed in numerous semiconductor wire bonders.
In recent years, the demands for ultrasonic bonding with various materials and fine pitch bonding have become complex and diversified. We provide reliable solutions for all of these needs. 【Features】 We offer a variety of types. ○ ST Type Transducer Standard ultrasonic transducer for pole bonders ○ ST-LE Type Transducer Ultrasonic transducer enabling fine pitch wire bonding ○ B Type Transducer Latest ultrasonic transducer for pole bonders ○ PT Type Transducer Standard ultrasonic transducer for wedge bonders ○ PT-LE Type Transducer Ultrasonic transducer enabling fine pitch wire bonding ○ W Type Transducer Latest ultrasonic transducer for wedge bonders ● For more details, please contact us or download the catalog.
basic information
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Price information
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Applications/Examples of results
Wire bonder, flip chip. Ultrasonic bonding transducer for bonding equipment.
