RINCO ultrasonic pouch sealing machine & Artech ultrasonic food cutter
[Free Sample Test Available] Can seal even during food chewing. Instant welding with power activation and slice cutting with a new shape of wide, thin ultrasonic knife!
"RINCO Ultrasonic Pouch Sealer Machine" This is a sealing device specialized for filling and packaging food and chemical products. It ensures high sealing strength even during filling when liquid drips or when there is biting into the welded surface due to static electricity. The ultrasonic sealer overcomes the drawbacks of heat sealing. 【Features】 ■ A one-head solution replacing the heat sealing and cooling process ■ Ensures sealing strength even when biting into liquids (oils, detergents) and solids (food) ■ No need for Teflon sheets/cooling heads for ultrasonic tools ■ No scorching of heat plates or adhesive residue ■ No need for temperature controllers or cartridge heater replacements "Artech Ultrasonic Food Cutter" This is an ultrasonic food cutter with a wide, thin knife that excels in improving productivity and slice cutting. It can accommodate large blades with a single 200W oscillator. 【Features】 ■ Conventional knives use a 1000W oscillator with a maximum width of 300mm (thickness of about 5mm) ■ The new knife uses a 200W oscillator with a width of over 400mm (blade thickness of less than 2mm) *For more details, please contact us or download the catalog.
basic information
Swiss RINCO Ultrasonic AG is a manufacturer of ultrasonic welders specializing in the welding and cutting of thin films and non-woven fabrics, resin welding, and metal joining. Swiss Artech Ultrasonic AG is a manufacturer of ultrasonic sieves specializing in ultrasonic powder sieving, ultrasonic hoppers, and ultrasonic knives. They are sister companies of our company, UC Japan Co., Ltd., within the same group. *We have product catalogs available, so please download them for your review.
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Model number/Brand name
RINCO USA
Applications/Examples of results
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.