[Free Gift!] UC Japan Co., Ltd. 'Comprehensive Catalog'
The latest comprehensive catalog featuring a variety of ultrasonic oscillators and welding machines.
This is the latest comprehensive catalog from UC Japan Co., Ltd., which has been developing domestic specifications in collaboration with major semiconductor manufacturing equipment manufacturers in Japan, building trust and a proven track record. As a leading global company in ultrasound with a strong reputation, we solve ultrasound-related issues! We are expanding our business in the global market and have a robust support system in various countries! *Currently, we are offering the comprehensive catalog for free!* [Contents (excerpt)] ■ Wire bonders for semiconductor manufacturing (from UC Technology) ■ Ultrasonic plastic welding machines / cutters (from Rinko Ultrasonics) ■ Ultrasonic powder sieving machines / ultrasonic hoppers (from Artec Ultrasonics) ■ Main features of ultrasonic oscillators / ultrasonic transducers and more *For more details, please refer to the catalog or feel free to contact us.*
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【Featured Products (Excerpt)】 ■ Model 10H-P2 Series ■ Various Transducers ■ Semi-Automatic Heavy Wire Bonder ■ Ultrasonic Plastic Welding Machine ■ Ultrasonic Metal Joining Machine with Servo Press Control ■ Ultrasonic Metal Joining Machine ■ Ultrasonic Pouch Sealer ■ Ultrasonic Hand Unit *For more details, please refer to the catalog or feel free to contact us.
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.