Prevention of powder adhesion and improvement of sieving efficiency: "Ultrasonic sieving, ultrasonic hopper"
Improvement of troubles such as clogging, adhesion, and agglomeration in the powder screening process, and increase in yield and reduction of time during classification!
The "Ultrasonic Sieve Unit" transmits special ultrasonic vibrations to each stainless steel mesh wire, resolving issues such as clogging, adhesion, agglomeration, and bridging in sieves and hoppers. It improves the classification efficiency in powder sieving processes and contributes to time savings! It achieves dry sieving with high mesh sizes such as 20μm and can be installed on mass production machines, including large Φ1200 models, from standard JIS mesh frames. 【Features】 ■ Ultrasonic hopper addresses surface adhesion, bridging, rat hole issues, and improves discharge capacity. ■ Removal of foreign substances and disintegration through ultrasonic sieving at the hopper discharge, resulting in fluffy powder that is advantageous for transport in the next process. ■ Quantitative supply transport with ultrasonic vibrations allows for integrated management with electronic scales. ■ The ultrasonic sieve machine (two-stage) enables even finer dry classification. Consulting services for ultrasonic vibration application are available. We also welcome comparative verification with other equipment that customers are currently using or considering. *For more details, please refer to the PDF materials and YouTube product introduction. Feel free to contact us with any inquiries.
basic information
【Ultrasonic Oscillator (DGS Model) Specifications】 Operating Frequency Range: 30kHz to 38kHz Maximum Output: Φ50–250: 50W, Φ300–400: 100W Power Supply: Single-phase 100V, 200V, 230V ±10% (50Hz/60Hz) multi-power supply built-in Weight: DGS Model 3.4kg, PNS Model 3.2kg Dimensions: Length 170mm x Width 280mm x Height 124mm (Note: PNS height is 91mm) Environmental Temperature: 0℃ to 45℃ (Humidity below 80% at 30℃) Safety Standards: CE, IP65 structure 【Ultrasonic Converter (C35-SD8 Model) Specifications】 Maximum Output: 120W (C35-SD8) Material: Titanium alloy body (C35-SD8) Weight: 270g 【Clamp Band Fixture Specifications】 Material: SUS304 (Optional SUS316L) Compatible Sizes: Φ50, Φ75, Φ100, Φ150, Φ200, Φ250, Φ300, and other sizes
Price range
Delivery Time
Model number/Brand name
Atec ultrasonic sieve machine
Applications/Examples of results
【Applications】 ■Coatings ■Battery materials ■Metal materials ■Resin materials ■Pharmaceutical materials/Food materials ■Toners ■Chemical products etc. *For more details, please refer to the PDF document or feel free to contact us.
Related Videos
Line up（4）
| Model number | overview |
|---|---|
| DGS35kHz | Ultrasonic oscillator 35kHz frequency 50W/100W |
| C35-SD8 | Ultrasonic converter (transducer) |
| HF5ｍ | HF cable 5m |
| Clamp band jig | Clamp-type band fixture for various sizes of standard sieves. |
catalog（5）
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Distributors
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.