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Improving Dispersion with Ultrasonic Powder Sifter for Coatings

Solving dispersion issues in paint manufacturing! Improving clogging and aggregation to enhance quality and efficiency.

In the paint industry, the uniform dispersion of pigments and additives affects product quality. Poor dispersion can lead to color unevenness, sedimentation, and a decrease in film performance. An ultrasonic powder sifter suppresses clogging and agglomeration of powders, promoting efficient dispersion. This contributes to improved paint quality and streamlined manufacturing processes. 【Application Scenarios】 - Dispersion process of pigments and additives - Quality control in paint manufacturing - Formulation studies in new product development 【Effects of Implementation】 - Stabilization of paint quality through improved dispersion - Increased yield by suppressing clogging and agglomeration - Enhanced productivity by reducing sifting time

UC Japan Co., Ltd. Artech Division Website

basic information

**Features** - Achieves dry screening with high mesh sizes such as 20μm openings. - Compatible with standard JIS mesh frames from Φ75 to Φ400, allowing for one-touch installation with clamp-type fixtures. - Measures against surface adhesion, bridging, and rat holes using an ultrasonic hopper, improving discharge capacity. - Removal of foreign substances and de-agglomeration through ultrasonic screening at the hopper discharge, resulting in fluffy powder advantageous for transport in the next process. - Enables synchronized management with electronic scales through quantitative supply transport using ultrasonic vibrations. **Our Strengths** UC Technology has cultivated ultrasonic technology for many years. We provide optimal solutions tailored to our customers' challenges, offering a wide range of support from experimental responses to demo equipment loans and consulting.

Price information

The rental evaluation of the demo unit is usually provided free of charge for two days. Please consult us for evaluations of demo units lasting more than a week. Additionally, feel free to contact us for a quote on the complete set of ultrasonic units.

Delivery Time

Model number/Brand name

Artec ultrasonic sieve DGS 35kHz, ultrasonic hopper FS 35kHz (FlowSonic)

Applications/Examples of results

【Purpose】The ultrasonic vibrating sieve, which can be easily attached to areas troubled by powder adhesion, is effective for countermeasures against mesh clogging caused by powder adhesion and handling issues in powder transport environments. It has been adopted in various stages from raw material development to mass production, including: ■ Paints ■ Battery materials ■ Metal materials ■ Resin materials ■ Pharmaceutical materials/Food materials ■ Toner ■ Chemical products          and more. *For more details, please refer to the PDF document or feel free to contact us. We have been exhibiting every year since 2008. This year's Powder Industry Exhibition will be held in Osaka. We look forward to seeing you all there. Our sales engineers will be available for consultations at the venue, where we will discuss various applications and case studies. 【Exhibition Information】 ■ Exhibition Name: "International Powder Industry Exhibition Osaka" ■ Venue: Intex Osaka ■ Dates: October 15-17, 2025 ■ Opening Hours: 10:00 AM - 5:00 PM (last day until 4:30 PM)

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Line up(4)

Model number overview
DGS35kHz Ultrasonic oscillator 35kHz frequency 50W/100W
C35-SD8 Ultrasonic converter (transducer)
HF5m HF cable 5m
Clamp band jig Clamp-type band fixture for various sizes of standard sieves.

Ultrasonic Powder Sifter Demo Machine Rental Service with Instruction Manual

PRODUCT

UCG Japan's Ultrasonic Equipment Comprehensive Catalog

CATALOG

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Distributors

UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.