V-net AAEON Official site

Our company will be exhibiting at the "28th IoT & Edge Computing Expo [Spring]" within Japan IT Week, which will be held at Tokyo Big Sight from April 8 (Wednesday) to April 10 (Friday), 2026! We will showcase an AI compact edge PC equipped with NVIDIA's Jetson Thor, boards and PCs featuring Intel's Panther Lake and Bartlett Lake, a vending machine-type demo using ARM boards, as well as touch panel PCs, tablet PCs, and other peripheral devices. ■ Dates: April 8 (Wednesday) - April 10 (Friday), 2026 ■ Hours: 10:00 AM - 6:00 PM (until 5:00 PM on the final day) ■ Venue: Tokyo Big Sight, West Hall 3 ■ Booth Location: W22-22 You can register for your visit at the URL below. We sincerely look forward to your attendance. https://www.japan-it.jp/spring/ja-jp/register.html?code=1606569853287533-WSW

Features: ●Core 3 N355/N150 ●DDR5 SODIMM x 1 (up to 16GB) ●HDMI 1.4, VGA, LVDS ●2.5GbE x 3, SATA 6Gb/s, GPIO 8-bit ●USB 3.2 Gen 2 x 2, RS-232/422/485 x 2, RS-232 x 2 ●Mini PCIe x 1, M.2 2230 E-Key x 1, M.2 3052 B-Key x 1 ●DC input 9V～36V

Features: ● Equipped with Intel Core Ultra 5 125H/Ultra 7 155H・155U ● DDR5 5600MHz SO-DIMM x2 slots (up to 96GB) (sold separately) ● LVDS x 1, eDP x 1, DP x 1, HDMI x 1 ● LAN x 3, SATA 6Gb/s x 1, 8-bit GPIO ● USB 3.2 Gen2 x 2, USB 2.0 x 4 ● M.2 2280 M-Key x 1 (PCIe 4.0 [x4]/SATA), M.2 3052 B-Key x 1, M.2 2230 E-Key x 1 ● DC 9~36V input * Heat spreader and fan-equipped heat sink sold separately GENE-MTH6-FAN: Fan-equipped heat sink GENE-MTH6-HSP: Heat spreader * Memory, storage, and OS are sold separately.

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)