Our company will be exhibiting at the "28th IoT & Edge Computing Expo [Spring]" within Japan IT Week, which will be held at Tokyo Big Sight from April 8 (Wednesday) to April 10 (Friday), 2026! We will showcase an AI compact edge PC equipped with NVIDIA's Jetson Thor, boards and PCs featuring Intel's Panther Lake and Bartlett Lake, a vending machine-type demo using ARM boards, as well as touch panel PCs, tablet PCs, and other peripheral devices. ■ Dates: April 8 (Wednesday) to April 10 (Friday), 2026 ■ Hours: 10:00 AM - 6:00 PM (until 5:00 PM on the last day) ■ Venue: Tokyo Big Sight, West Hall 3 ■ Booth Location: W22-22 You can register for your visit at the URL below. We sincerely look forward to your visit. https://www.japan-it.jp/spring/ja-jp/register.html?code=1606569853287533-WSW

Features: ● Equipped with NVIDIA Jetson T5000 ● 128GB LPDDR5X onboard memory ● 25GbE LAN x 4 for Sensor Integration ● 5GbE LAN x 3, RS-485 x 2 for LiDAR ● DIO/CANBus

Features: ● Compatible with Intel Core Ultra processors (Series 2) ● A1 SKU: Intel H810 chipset A2 SKU: Intel Q870 chipset ● Intel Xe LPG graphics engine ● DDR5 SODIMM ×2, up to 96GB (sold separately) ● HDMI 2.0 ×2 ● 2.5GbE LAN ×2, 1GbE LAN ×1 ● 10V–35V DC input (4-pin terminal block) ● Wide temperature range: -25°C to 60°C ● Equipped with TPM 2.0 ● Supports iAMT (A2 SKU only) * This model does not include memory, storage, or OS.

Features ● Intel Core i3-1320PE/i5-1340PE/i7-1370PE ● DDE5 SODIMM x 2 (up to 96GB) (sold separately) ● 2.5 GbE x 5 (including 4 PoE ports) ● PCIe [x1] Slot x 1 & PCI Slot x 1 for expansion ● DC power input compatible with 9V to 36V ● Wide temperature operation range -20℃ to 60℃

Features: ● Equipped with Intel 13th generation Core i3-1320PE/i5-1340PE/i7-1370PE ● Equipped with Intel Iris Xe graphics ● DDR5 SODIMM x 2 slots, expandable up to 96GB (sold separately) ● Supports dual HDMI video output ● Equipped with 2.5G LAN x 5 (4 ports support IEEE802.3 at PSE) Maximum power supply capacity when using DC12V–18V power: 20W (total for 4 ports) Maximum power supply capacity when using DC19V–36V power: 60W (total for 4 ports) ● Wide range 9–36V DC power input (terminal block type) ● Operating temperature range -25–60°C ● Onboard TPM 2.0 * This model does not include memory, storage, or OS.

Features: ● NVIDIA Jetson Orin NX 8GB/16GB ● Fanless design ● 8GB/16GB onboard memory ● PoE/PSE GbE LAN x 8 * 4 ports of PoE share one MAC address and Giga bandwidth * Supports a total of 120W PoE with input of 24V or higher, 80W PoE with input of 12-24V, and 80W PoE with input of 12V or lower. ● Giga LAN x 2 ● Supports 9V-36V DC input and can also accommodate ACC ignition delay On/Off ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Pre-installed with Jetpack 6.0.0

Features: ● Equipped with NVIDIA Jetson Orin NX ● Supports JetPack 6.2 Super mode ● 8GB/16GB LPDDR5 onboard memory ● USB 3.2 Gen 2 x 4 ● RS232 x 1 ● 10-pin header DIO ● Expansion: M.2 2230 E-Key x 1, M.2 3052 B-Key x 1

Features: ● 15-inch TFT LCD display (1024 x 768) ● Equipped with Intel N50/97 ● Projected capacitive multi-touch support ● Aluminum chassis design ● Front panel compliant with IP65 (dustproof and waterproof) ● Fanless structure ● VESA mount / mount bracket compatible ● Supports wide power input of 9-30V DC * No memory, storage, or OS included

Features: ● 27-inch (1920 x 1080) TFT LCD display ● Equipped with 12th generation Intel Core i3-1215UE/i5-1245UE/i7-1265UE/Celeron 7305E processors ● Memory DDR5 SODIMM 2 slots (sold separately) ● Projected capacitive touch panel ● M.2 2280 M-Key × 1 (NVMe compatible) ● Aluminum chassis design ● Front panel compliant with IP65 (dustproof and waterproof) ● Fanless design ● Built-in VESA mount / panel mount bracket ● Wide power input range of 9-30V DC ● AC adapter sold separately ● Memory, storage, OS not included

Features: ● 23.8-inch (1920 x 1080) TFT LCD display ● Equipped with 12th generation Intel Core i3-1215UE/i5-1245UE/i7-1265UE/Celeron 7305E processors ● DDR5 SODIMM memory, 2 slots (sold separately) ● Projected capacitive touch panel ● M.2 2280 M-Key × 1 (NVMe compatible) ● Aluminum chassis design ● Front panel compliant with IP65 (dustproof and waterproof) ● Fanless design ● Built-in VESA mount / panel mount bracket ● Wide range power input compatible with 9-30V DC ● AC adapter sold separately ● Memory, storage, and OS not included

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional accessories ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)

Features: ● Equipped with Intel Core Ultra 9 285H/7 255H/5 225H ● DDR5 SODIMM x 2 (up to 128G) (sold separately) ● VGA Switch DDI x 1, LVDS colay eDP x 1, DDI x 2 ● USB 2.0 x 8, USB 3.2 Gen 2 x 4 ● PCIe [x1] x 4, PCIe [x4] x 1, PEG [x8] + [x4] + [x4] ● 2.5GbE x 1 ● COMe Type6 standard, 95mm x 95mm size ● Operating temperature -20~70℃ ● Sold separately ECB-920A: Development carrier board COM-MTHC6-FAN01: CPU fan COM-MTHC6-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Intel Core Ultra 9 185H / 7 155H / 5 125H processors ● DDR5 5600MHz Dual Channel SODIMM×2 (up to 96GB) (sold separately) ● VGA switch DDI×1, LVDS colay eDP×1, DDI×2 ● USB 2.0×8, USB 3.2 Gen 2×4 ● PCIe [x1]×4, PCIe [x4]×1, PEG [x8] + [x4] + [x4] ● 2.5GbE×1 ● DC 9~16V input ● COM Express Type 6, 3.75 inches × 3.75 inches (95mm × 95mm)

Features ● Compatible with 12th/13th/14th generation Intel Core i series ● Equipped with 32GB memory and 512GB 3DTLC SSD *Changeable as an option ● Comes with Windows 11 IoT Enterprise *Changeable as an option ● Equipped with 1 HDMI, 1 DP, and 1 VGA port ● Rear I/O includes 4 USB 3.2, 4 LAN, and 1 COM ● Long-term supply model ● BTO options available from a single unit, allowing changes to CPU, memory, etc.

Features ● Equipped with Intel Core i9-13900E / i5-13500E *optional change available ● Equipped with 64GB memory *optional change available ● Equipped with 512GB 3D TLC SATA SSD *optional change available ● Equipped with Windows 11 IoT Enterprise *optional change available ● HDMI x2, DP x2 included ● Rear I/O includes USB 3.2 (Gen2) x3, USB 3.2 (Gen1) x2 ● BTO support available from one unit

Features ● Equipped with Intel Core i9-13900E/i5-13500E *Optional upgrade available ● 64GB memory installed *Optional upgrade available (up to 128GB) ● 2.5-inch 3D TLC SSD 512GB installed *Optional upgrade available ● Windows 11 IoT Enterprise installed *Optional upgrade available ● HDMI x1, DP x1, VGA x1 ports available ● Rear I/O side USB 3.2 Gen 2 x4, USB Type-C x1, GbE x2, 2.5GbE x2, RS-232/422/485 x1

Features: ● Equipped with Intel Processor N150 ● Onboard memory LPDDR5 8GB ● Onboard storage eMMC 64GB ● 1 GbE LAN x 1 ● HDMI 1.4b x 1 ● USB 3.2 Gen 2 (Type-A) x 3 ● 12V DC input ● TPM 2.0 ● Operating temperature of the main unit: 0℃ to 55℃ (AC adapter supports 0 to 40℃) * This is a model without an operating system.

Features: ● Equipped with Intel Processor N150 ● Onboard memory LPDDR5 8GB ● Onboard storage eMMC 64GB ● 1 GbE LAN x 1 ● HDMI 1.4b x 1 ● USB 3.2 Gen 2 (Type-A) x 3 ● 12V DC input ● TPM 2.0 ● M.2 2230 E-Key (PCIe[x1], USB2.0 x 1) ● GPIO x 8, COM x 1 ● Operating temperature of -5℃ to 60℃ (AC adapter supports 0 to 40℃) * This is a model without an OS.

Features: ● Equipped with Intel Processor N150 ● Onboard memory LPDDR5 8GB ● Onboard storage eMMC 64GB ● GbE RJ-45 x 2 ● USB 3.2 Type-A x 3 ● DP 1.2 / HDMI 2.0b / eDP 1.3 ● RS232/422/485 x 2 ● M.2 2230 E-Key x 1 (PCIe x1, USB2.0 x1) ● M.2 2280 M-Key x 1 (PCIe x2) ● TPM 2.0 ● 12V DC input ● Operating temperature of 0℃ to 60℃ (AC adapter supports 0 to 40℃) * This model does not come with an OS.

Features ● Equipped with 12th/13th generation Intel(R) Core(TM) i7-1370PE / i5-1350PE / i3-1320PE / i7-1270PE / i5-1250PE / i3-1220PE ● Dual channel DDR5 SODIMM x 2 slots (memory sold separately) ● Supports M.2 2280 M Key NVMe SSD ● Wide operating temperature range (-20 to 60℃) (WT model required for memory and storage) ● Equipped with a total of 3 LAN ports: 2.5GbE x 2 and GbE x 1 ● Supports TPM 2.0

Features ● For industrial automation controllers ● DIN rail compatible ● Equipped with Intel Atom x7211E / Processor N200 / Processor N50 ● DDR5 4800 SO-DIMM×1 (up to 16GB) (sold separately) ● Onboard TPM 2.0 ● Supports 9~36V DC input ● Wide temperature range -20~60℃

Our company will be exhibiting our products at the Mikasa Trading booth during "Edge Tech+2025," which will be held at Pacifico Yokohama from November 19 (Wednesday) to November 21 (Friday), 2025! We will showcase AI compact edge PCs equipped with NVIDIA's Jetson series, as well as embedded boards featuring Intel's Amston Lake and Arrow Lake, and ARM's i.MX8 series. ■ Dates: November 19 (Wednesday) to November 21 (Friday), 2025 ■ Hours: 10:00 AM - 5:00 PM (until 6:00 PM only on November 20, Thursday) ■ Venue: Pacifico Yokohama, Hall C ■ Booth Location: CJ-15 You can register for your visit at the URL below. We sincerely look forward to your attendance. https://www.jasa.or.jp/expo/

Features ● PICO-ITX standard ● Equipped with Intel Core Ultra 7 255U / Ultra 5 225U ● 16/32GB onboard memory ● 2.5GbE + 1GbE ● HDMI 1.4 + eDP 1.4 ● M.2 2280 M-Key x 1 (PCIe 4.0 [x4]/SATA) ● M.2 2230 E-Key x 1 (PCIe 4.0 [x1] + USB 2.0) ● USB 3.2 Gen 2 x 2 + USB 2.0 x 2 ● RS-232/422/485 x 2 ● TPM, GPIO 4-bit, SATA 6Gb/s x 1 ● SMBus/I2C (Default: SMBus) ● Intel AMT Support * This model does not include storage or OS.

Features ● Equipped with Intel(R) 13th Generation Raptor Lake Core i3-1320PE/i5-1335UE/i5-1340PE/i7-1370PE/i7-1370PRE Processor U300E ● DDR5 4800 MHz Dual Channel SODIMM x2 slots (up to 64GB) (sold separately) ● LVDS x1, eDP x1, DP x1, HDMI x1 ● 2.5GbE x1, GbE x1, SATA 6Gb/s x1, GPIO x8-bit ● USB 3.2 Gen 2 x3, USB 2.0 x4, USB Type C x1, RS-232/422/485 x4 ● M.2 2280 M-Key x1 (PCIe 4.0 [x4] x 1), M.2 2230 E-Key x1, M.2 3052/3042/2242 B-Key x1 ● Wide DC Input 9-36V

Our company will be exhibiting our products at the Mikasa Trading booth during "Edge Tech+2025," which will be held at Pacifico Yokohama from November 19 (Wednesday) to November 21 (Friday), 2025! We will showcase AI compact edge PCs equipped with NVIDIA's Jetson series, as well as embedded boards featuring Intel's Amston Lake and Arrow Lake, and ARM's i.MX8 series. ■ Event Dates: November 19 (Wednesday) to November 21 (Friday), 2025 ■ Hours: 10:00 AM - 5:00 PM (until 6:00 PM only on November 20, Thursday) ■ Venue: Pacifico Yokohama, Hall C ■ Booth Location: CJ-15 You can register for your visit at the URL below. We sincerely look forward to your attendance. https://www.jasa.or.jp/expo/

Features ● Equipped with 12th generation Intel Core i3-N305 / Atom x7211E / N50 / N97 ● Supports DDR5 SO-DIMM x1 (up to 32GB) (sold separately) ● USB 3.2 Gen2 x3, USB 2.0 x4 ● 2.5 GbE x1 ● M.2 2280 M-Key / M.2 2230 E-Key ● M.2 3052 B-Key for 5G ● DC 9~36V input

Features: ● Equipped with Intel Core Ultra 9 185H / 7 155H / 5 125H processors ● DDR5 5600MHz Dual Channel SODIMM x2 (up to 96GB) (sold separately) ● VGA switch DDI x1, LVDS colay eDP x1, DDI x2 ● USB 2.0 x8, USB 3.2 Gen 2 x4 ● PCIe [x1] x4, PCIe [x4] x1, PEG [x8] + [x4] + [x4] ● 2.5GbE x1 ● DC 9~16V input ● COM Express Type 6, 3.75 inches x 3.75 inches (95mm x 95mm)

Features: ● Equipped with Intel Core Ultra 5 125H/7 155H ● LPDDR5 16GB onboard memory ● NVMe 128GB onboard storage ● eDP x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen2 x 2 ● PCIe 4.0[x1] x 4 ● 2.5GbE x 1 ● COMe Type10 standard, size 84mm x 55mm ● Optional items ECB-920A-0001: Development carrier board NANOCOM-MTU-FAN: CPU fan NANOCOM-MTU-HSP: Heat spreader (Note: Heat dissipation is required in the enclosure)

Features: ● Equipped with ARM MediaTek Genio 700 / 510 ● Onboard LPDDR4 8GB ● HDMI 2.0 x 1, DP 1.4 x 1 ● eDP 2 lanes x 1, MIPI-DSI 4 lanes x 1 ● GbE x 1 ● USB 3.0 + 2.0 x 1, USB 2.0 x 5 ● UART x 4, GPIO x 12, MIPI CSI x 2, TPM 2.0 ● Fan-equipped heatsink, heatsink available separately ● Carrier board available separately