Supports from a minimum diameter of φ0.05mm to mass production of tens of thousands of units. Contributes to quality stability and yield improvement in semiconductor testing with high-precision micro-machining of ±0.005mm.

The downloadable materials introduce high-precision cutting examples of fine contact probe components used in semiconductor electrical inspection processes. With the miniaturization and high-density of semiconductor devices, fine probe components require fine diameters, high precision, and stable supply. Our company achieves dimensional accuracy of ±0.005mm across a wide size range from φ0.05 to φ10mm through the optimization of processing conditions specialized for fine component machining and know-how based on material characteristics. We can handle everything from prototypes to mass production (tens of thousands of units) with consistent quality. 【Product Specifications】 ■ Application: Contact probe components for semiconductor electrical inspection ■ Machining Range: φ0.05 to φ10mm ■ Dimensional Accuracy: ±0.005mm ■ Quantity Supported: Prototypes to mass production (tens of thousands of units) ■ Processes Supported: Cutting, cleaning, inspection 【Supported Materials】 Brass, beryllium copper, phosphor bronze, SK materials, Pd, SUS, etc. We conduct dimensional measurements, appearance inspections, and surface condition checks using image inspection machines, establishing a consistent quality management system from processing to inspection. If you are facing challenges with fine machining, precision cutting, or mass production of semiconductor inspection components, please feel free to consult us. *For more details, please download the PDF materials.

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