All products and services
91～120 item / All 143 items
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【Grinding Pad (PAD)】 Introduction of pad standard plate size and abrasive grain hole processing.
Increased production efficiency with reduced pad replacement time!
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Introduction of the polishing material (abrasive) for cerium oxide glass: "MIREK"
To a higher level of polishing precision!
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Abrasive Material (Agent) Mirek HL Series (2-element product) Dry Powder Type
The average particle size is approximately 0.5 to 1.5 μm! The classification accuracy is high, and the product quality is stable.
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Abrasive Material (Agent) Mirek HL Series (2 Element Product) Slurry Type
From optical glass to quartz glass and crystal! For applications that require high-quality surface precision.
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Types and adhesive strength of double-sided tape on the back of the grinding pad (PAD).
It needs to be changed according to the purpose or use!
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Black smoke-containing wastewater treatment powder coagulant "Oil Flock"
Significantly reduce disposal costs by processing and consolidating black smoke!
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Solid coagulant for grinding wastewater treatment "Declouding Tab"
No need to adjust the amount; just soak it to see the effects!
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Shape management of lap plates troubled by grinding scratches and rate reduction.
Properly understand the fixed plate shape of lap and polish plates. Visualize the overall deformation and support the consideration of optimal maintenance methods.
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The flatness accuracy management is confirmed with a straight gauge.
Reassess the causes of scratches, decreased rate, and worsening parallelism from the perspective of the surface plate shape. For checking, use only a straight gauge!
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The measures for scratches on double-sided lap and polish start with confirming the flatness accuracy.
Confirming the deterioration of yield in double-sided lap and polish processing from the shape of the reference plate.
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Do you know the cause of the flatness and the deformation of the grinding pad shape?
To prevent deterioration of scratches, parallelism, and rate reduction, first check for shape changes.
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Verification of the correction effect of the double-sided lap plate (shape confirmation using a straight gauge)
Confirm the shape of the reference plate that leads to deterioration of scratches and flatness with measured data.
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Straight gauge for precision management of grinding pads (PAD).
Preventing quality variation and improving yield depend on the accuracy of PAD!
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Polishing Pad (PAD) - A brush carrier that protects the PAD and extends its lifespan.
If you don't remove the dirt from the grinding pad, it will lead to scratches!
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Recommended grain size for dresser for urethane PAD in correction careers.
The dresser also changes its granularity depending on the purpose!
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Water Clear (Alkaline Type) that can treat alkaline wastewater with a single agent.
You can easily treat it with a single agent without using neutralization equipment or hazardous chemicals!
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Clear water, effective use of oil flock.
By using it skillfully, the powder agglomerant can easily treat turbid water at a low cost!
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Clear water, the oil flock is effective even in such dirty water.
Why not give dirty wastewater a try!
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Sapphire - Fixed abrasive tools for difficult-to-grind materials.
For flat grinding of sapphire, hard-to-grind materials, glass, ceramics, metals, and resins.
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Fixed abrasive tools for semiconductor manufacturing.
High-precision flat grinding processing of glass, ceramics, metals, and resins.
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Ceramics processing is also possible, fixed abrasive tool Buriemur.
Improving the machinability of ceramics! Stabilization of the rate and flatness in surface grinding processing.
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Fixed abrasive: Briermeur
For flat grinding processing of glass, ceramics, metals, and resins!
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What is a straight gauge in grinding/measurement?
What is a straight gauge! A way of thinking to capture the flat plate shape / a way of thinking to identify problems.
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How to choose cerium oxide polishing materials (abrasives)
Introducing how to choose from various types of cerium oxide polishing materials!
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Things other than the numerical values felt during processing.
Introducing how to minimize mistakes and press the edit button without hesitation.
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What will the future of precision grinding pads (PAD) be like?
What will ultimately happen! A discussion on the future possibilities of precision polishing pads.
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Support for reducing scratches in wafer polishing for semiconductors.
It helps suppress variations and fine scratches generated during the precision polishing of semiconductor wafers, supporting the achievement of high flatness and stable surface quality.
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【Polishing Pad (PAD)】Achieve high-quality precision polishing! Non-woven fabric pad.
Non-woven fabric pads in the first grinding process! An introduction to non-woven fabric pads in a column.
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【Grinding Pad (PAD)】Double-sided tape for precision grinding pads.
Use double-sided tape to attach it to the grinding plate! Here are some recommendations for what kind of double-sided tape is good for precision grinding pads.
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Is colloidal silica changing!? Here are some measures against drying and adhesion!
Are you struggling with the drying and adhesion of colloidal silica? Let me introduce some alternative solutions.
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