Support for reducing scratches in wafer polishing for semiconductors.
It helps suppress variations and fine scratches generated during the precision polishing of semiconductor wafers, supporting the achievement of high flatness and stable surface quality.
In the precision polishing process of semiconductor wafers, issues such as polishing unevenness and fine scratches can arise. These can affect the yield of subsequent processes and the performance of the final product, making the stabilization of processing conditions essential. Our non-woven polishing pads are designed for precision polishing that requires high flatness and surface quality. With features that support uniform polishing, they help reduce polishing unevenness and stabilize processing quality. Additionally, their excellent workability contributes to reducing variations in processing conditions. They can also be considered for polishing various materials that require high flatness, including semiconductor wafers. Since results may vary depending on processing conditions, we recommend confirming through preliminary testing. 【Features】 ■ Supports uniform polishing and contributes to the suppression of polishing unevenness ■ Assists in reducing fine scratches and improving surface quality ■ Excellent workability helps suppress variations in processing conditions ■ Supports the coexistence of high flatness and excellent surface quality ■ Suitable for precision polishing processes, including semiconductor wafers *For more details, please refer to the related links or feel free to contact us.
basic information
【Features】 - A polishing cloth made by bonding short fibers called non-woven fabric with resin - The typical color is white - Excellent surface accuracy - Easy to handle - Compared to urethane pads, it may not achieve a high polishing rate, but it has advantages in surface accuracy and ease of handling 【Our Strengths】 Yachiyo Micro Science is a specialized trading company for grinding and polishing materials, established in 1937. We are also focused on product development through our research and development department, and we operate technical information sites "Grinding and Polishing.COM" and "Agglomerants.COM." We handle a wide range of products, including diamond tools, cerium oxide polishing materials, diamond pellets, polishing pads, and other grinding and polishing auxiliary materials, as well as agglomerants.
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Distributors
Since its establishment in 1937 (Showa 12), Yachiyo Micro Science has been a specialized trading company for grinding and polishing materials, while also continuously engaging in product development related to grinding and polishing through its research and development department. We also operate the technical information sites "Grinding and Polishing .COM" and "Aglutinants .COM." Please take a look.