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The "CB-600" is a flip chip bonder designed for ultra-low load applications. It enables heating and bonding from room temperature to 450°C through a tool lift operation that utilizes high-precision Z-axis control, with a ceramic heater. With a head exchange, it also supports ultrasonic bonding (customer replaceable). Additionally, due to its highly versatile equipment concept, it accommodates various packages (*1) and bonding processes (*2). *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, solder, ultrasonic, etc. 【Features】 ■ Ultra-low load compatibility ■ High-precision bonding ■ Tool lift operation utilizing high-precision Z-axis control ■ Supports ultrasonic bonding with tool exchange *For more details, please refer to the PDF document or feel free to contact us.

【Overview】 ■ Response Process 1. Heat Pressing 2. Ultrasonic Joining ■ Automatic Tool Exchange Function (when using heat pressing) 1. Automatic exchange function for chip pickup tools 2. Multi-chip mounting is possible due to the above function ■ Process Management 1. Process analysis logs can be exported 2. Easy recipe standard included *For more details, please refer to the PDF document or feel free to contact us.

It may vary depending on the optional features, so please feel free to contact us.

P7

OTHER

Please feel free to contact us. (Negotiable)

Flip Chip Bonder CB-600

【Applications】 ■Compatible with various packages for MEMS, 5G, data communication, millimeter-wave sensors, photonics, and AR fields. ■Customized with a variety of options, primarily offered to overseas users focusing on R&D. *For more details, please refer to the PDF document or feel free to contact us.