IC package automatic appearance inspection device 'LI700E'
Achieve automation of IC packaging with space-saving design! Inspection equipment capable of high-precision 2D and 3D dimensional measurement.
The "LI700E" is an appearance inspection device that conducts dimensional inspections such as terminal bending of IC packages, as well as defect inspections for scratches and foreign objects. It achieves automation of inspections in a compact space. Inspections are performed from the bottom of the product, checking the mold surface and terminal surface, followed by pass/fail judgment and sorting. 【Features】 ■ High-precision 2D & 3D dimensional measurement ■ Defect inspection ■ Compact and space-saving ■ Automatic health check function ■ Support for traceability data management *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Specifications】 ■ Target tray: JEDEC tray ■ Device size: 1,230 (W) × 1,235 (D) × 1,500 (H) mm ■ Device weight: Approximately 900 kg ■ Processing capacity: 1,000 units per hour (3.6 seconds per unit) ■ Power supply: Three-phase AC 200V ±10% 4KVA ■ Air supply: 0.39 MPa or higher (4 kgf/cm² or higher) 200 L/min (referring to dry air) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
