Low Dk & Low Df Adhesive Sheet AD-3379H
Suitable for high multilayering of high-frequency substrates.
●Dk=3.01 / Df=0.0019 @80GHz ●High resin fluidity and excellent circuit embedding properties ●Composite substrate with PTFE substrates or MPI substrates is possible ●Can be laminated at a relatively low temperature of 180°C due to thermosetting properties ●Suitable for skew prevention without including glass cloth ☆This material is for manufacturers of printed circuit boards.
basic information
We would like to propose the use of AD-3379H as an interlayer adhesive when increasing the number of layers in printed circuit boards for 5G communication devices such as servers, power amplifiers, and routers. AD-3379H excels in circuit embedding even at a thickness of 25μm. This enables multilayering of high-frequency circuit boards without compromising the dielectric properties of the entire substrate. We provide an insulating resin (semi-cured) with excellent dielectric properties and adhesive performance, stretched to about 0.1mm thick and sandwiched between release films.
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Model number/Brand name
AD-3379H
Applications/Examples of results
High multilayering of high-frequency circuit boards.
Line up（1）
| Model number | overview |
|---|---|
| AD-3379H | Thermosetting PPE resin-based low dielectric constant & low dielectric loss tangent adhesive sheet |
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The fundamental technologies of our company are Laminating Technology and Casting Technology. We are deeply exploring these two technologies and advancing diversification. In the case of general-purpose products, we continue our self-help efforts, such as pursuing thorough rationalization to become a last-one company.