Announcement of Corporate Booth Exhibition at IEEE ITC-Asia 2023: The 7th IEEE International Test Conference in Asia 2023: International Conference on Semiconductor Integrated Circuit Test Technology.

TAKAYA Corporation株式会社

Takaya Corporation has become an official partner of "IEEE ITC Asia 2023." "IEEE ITC Asia 2023" is the Asian version of the IEEE International Test Conference, which is the largest international conference in the field of IC testing. The conference aims to promote more discussions and exchanges between the global academic and industrial communities through keynote speeches, keynote panel discussions, and paper presentations, gathering researchers and university representatives related to IC testing. This year's IEEE ITC Asia will be held for three days from September 12 (Tuesday) to September 14 (Thursday), 2023, at the Kunibiki Messe in Matsue City, Shimane Prefecture, and Takaya Corporation will have a corporate introduction booth (including panels, etc.) displayed at the venue. If you attend this conference, please be sure to visit Takaya's booth as well.

Date and time 2023年09月12日（火）～ 2023年09月14日（木）
Capital Shimane Prefectural Industrial Exchange Hall Kunibiki Messe Address: 1-2-1 Gakuen Minami, Matsue City, Shimane Prefecture 690-0826
Entry fee 有料 Registration is required from the organizer's website.

Related product information

Flying Probe Tester: APT-1340J *Evaluation tests currently accepted
It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a specialized probe to the electronic circuit board, which has electronic components mounted on it, and applying a minute electrical signal for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This method allows for the inspection of "connection reliability between electronic components and the board," "the values of individual mounted electronic components (such as resistors and capacitors)," and "diode polarity," without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: ● Solder shorts and opens ● Pattern disconnections ● Missing components ● Incorrect component values ● Reverse insertion of polarized components ● Lifted leads of ICs and connectors ● Operation confirmation of digital transistors, optocouplers, and Zener diodes ● Other simple function tests
Flying Probe Tester: APT-1400F-SL * Testing in progress
It is a board inspection device capable of ultra-fast in-circuit testing at a top-class industry level. (Supported board size for inspection: up to 985×610)

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a dedicated probe to the electronic circuit board, which has electronic components mounted on it, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This testing checks the "connection reliability between electronic components and the board," the "values of individual mounted electronic components (such as resistors and capacitors)," and the "polarity of diodes," all without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: ● Solder shorts and opens ● Pattern disconnections ● Missing components ● Incorrect component values ● Reverse insertion of polarized components ● Lifted leads of ICs and connectors ● Operation verification of digital transistors, optocouplers, and Zener diodes ● Other simple function tests
Dual Side Flying Probe Tester: APT-1600FD
This is a flagship model that arranges probe heads on both the top and bottom, enabling simultaneous in-circuit testing of the front and back of the substrate.

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a dedicated probe to the electronic circuit board, which has electronic components mounted, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This method allows for the inspection of "connection reliability between electronic components and the board," "the values of individual mounted electronic components (such as resistors and capacitors)," and "diode polarity," without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection items include: - Solder shorts and opens - Pattern disconnections - Missing components - Incorrect component values - Reverse insertion of polarized components - Lifted leads of ICs and connectors - Operation confirmation of digital transistors, optocouplers, and Zener diodes - Other simple function tests.
Dual Side Flying Probe Tester APT-1600FD-SL
The probe head is arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (substrate) and power is supplied. The process of contacting a specialized probe to the electronic circuit board, which has electronic components mounted on it, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This testing checks the "connection reliability between electronic components and the substrate," "the values of individual mounted electronic components (such as resistors and capacitors)," and "the polarity of diodes," without applying unnecessary load to the substrate itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: - Solder shorts and opens - Pattern disconnections - Missing components - Incorrect component values - Reverse insertion of polarized components - Lifted leads of ICs and connectors - Operation confirmation of digital transistors, optocouplers, and Zener diodes - Other simple function tests