The presentation materials for the 38th Spring Conference of the Electronics Packaging Society have been released. "Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers."

TAKAYA Corporation株式会社

The 38th Electronics Packaging Conference was held from March 13 (Wednesday) to 15 (Friday), 2024, at the Noda Campus of Tokyo University of Science. At this conference, Mr. Yanagida, the Technical Department Manager of Takaya Corporation's Industrial Equipment Division, gave a presentation on "The Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers." The presentation materials from that event have been made available, so please take a look at the related catalog page below. -------- Content -------- To ensure reliable assembly guarantees for printed circuit boards, electrical testing is essential. However, a single testing method alone cannot achieve sufficient test coverage. To address this issue, we introduce a hybrid testing system that integrates flying probe testers and JTAG boundary scan testing. By complementing each testing method, we can maximize the test coverage for high-density printed circuit boards, enabling more accurate fault diagnosis.

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Related product information

Collaboration with boundary scan testing using a flying probe tester.
We will create new value through the mutual complementarity of ICT and BST.

Please contact the sales representative.
Flying Probe Tester: APT-1340J *Evaluation tests currently accepted
It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a specialized probe to the electronic circuit board, which has electronic components mounted on it, and applying a minute electrical signal for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This method allows for the inspection of "connection reliability between electronic components and the board," "the values of individual mounted electronic components (such as resistors and capacitors)," and "diode polarity," without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: ● Solder shorts and opens ● Pattern disconnections ● Missing components ● Incorrect component values ● Reverse insertion of polarized components ● Lifted leads of ICs and connectors ● Operation confirmation of digital transistors, optocouplers, and Zener diodes ● Other simple function tests
Flying Probe Tester: APT-1400F-SL * Testing in progress
It is a board inspection device capable of ultra-fast in-circuit testing at a top-class industry level. (Supported board size for inspection: up to 985×610)

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a dedicated probe to the electronic circuit board, which has electronic components mounted on it, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This testing checks the "connection reliability between electronic components and the board," the "values of individual mounted electronic components (such as resistors and capacitors)," and the "polarity of diodes," all without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: ● Solder shorts and opens ● Pattern disconnections ● Missing components ● Incorrect component values ● Reverse insertion of polarized components ● Lifted leads of ICs and connectors ● Operation verification of digital transistors, optocouplers, and Zener diodes ● Other simple function tests
Dual Side Flying Probe Tester: APT-1600FD
This is a flagship model that arranges probe heads on both the top and bottom, enabling simultaneous in-circuit testing of the front and back of the substrate.

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a dedicated probe to the electronic circuit board, which has electronic components mounted, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This method allows for the inspection of "connection reliability between electronic components and the board," "the values of individual mounted electronic components (such as resistors and capacitors)," and "diode polarity," without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection items include: - Solder shorts and opens - Pattern disconnections - Missing components - Incorrect component values - Reverse insertion of polarized components - Lifted leads of ICs and connectors - Operation confirmation of digital transistors, optocouplers, and Zener diodes - Other simple function tests.
Dual Side Flying Probe Tester APT-1600FD-SL
The probe head is arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (substrate) and power is supplied. The process of contacting a specialized probe to the electronic circuit board, which has electronic components mounted on it, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This testing checks the "connection reliability between electronic components and the substrate," "the values of individual mounted electronic components (such as resistors and capacitors)," and "the polarity of diodes," without applying unnecessary load to the substrate itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: - Solder shorts and opens - Pattern disconnections - Missing components - Incorrect component values - Reverse insertion of polarized components - Lifted leads of ICs and connectors - Operation confirmation of digital transistors, optocouplers, and Zener diodes - Other simple function tests
Multi-Probe System (Exclusive Option for 1600/2600FD)
Programming for FPGAs and special performance tests such as BST can be handled with a flying probe tester.

Takaya is highly regarded as a leading manufacturer of flying probe testers representing Japan, receiving acclaim in countries around the world. Its areas of activity extend not only to the home appliance industry but also to the medical device industry and the automotive industry, which require high quality standards, as well as the aerospace industry, which has very high entry barriers.