In the October 2025 issue of the monthly magazine "Inspection Technology" (Nihon Kogyo Shuppan), an article about our latest technology has been published. Published article: "Latest Trends in Flying Probe Testers Equipped with New Technology" Author: Koki Yanagida, Industrial Equipment Division, Takaya Corporation This paper discusses the technological innovations of the latest flying probe testers designed to accommodate the high-speed and high-density printed circuit boards, as well as examples of the introduction of JTAG collaboration and ZERO impact technology.

Our paper has been published in the "Journal of the Japan Institute of Electronics Packaging" (hereinafter referred to as "JIEP"), Vol. 28 No. 6 (September 2025). Published Paper "Development of an Ultra-High-Speed Flying Probe Tester for PCB Assembly Inspection" Author: Kouki Yanagida Paper Summary This paper reports on a new technology for the ultra-high-speed flying probe tester developed to address the challenges of high cost and difficulty in accessing fine components associated with traditional fixture-based in-circuit testing, proposing a new standard for next-generation high-density assembly board inspection.

Recently, a case study of Takaya Corporation has been published on the official website of i-PRO Co., Ltd. Our company has been addressing the challenge of developing and manufacturing a new type of flying probe tester by establishing a system to remotely understand the internal conditions of the equipment and expedite initial response. As a solution, we have introduced i-PRO's network cameras, achieving faster troubleshooting through real-time monitoring and enhancing quality control in the inspection process. In this case study, the background of the introduction, reasons for product selection, operational innovations, and the effects after implementation are presented from the perspective of the on-site personnel. Please take a look at the related link below.

Takaya Corporation will be exhibiting at the "MES2025 35th Microelectronics Symposium," which will be held for three days from September 3 (Wednesday) to September 5 (Friday), 2025, at the Osaka University Nakanoshima Center in Osaka City, Osaka Prefecture. Takaya plans to showcase a panel related to the APT series of flying probe testers. This symposium is a valuable opportunity to gather the latest research results and industry trends regarding electronic device packaging technology. We warmly invite you to visit Takaya's booth when you attend. We look forward to welcoming you.

The "APT-2600FD" is an in-circuit tester that inspects the continuity and resistance values of circuit boards with high precision. The "flying probe" test technology, which uses high-speed contact probes, was developed by Takaya as the world's first and boasts a world-class market share. This product has undergone a model change after 10 years and is equipped with numerous advanced technologies, including sophisticated control functions to prevent board damage and a high-resolution image inspection system. It achieves a balance between precision and efficiency, establishing a new standard for quality assurance. This award is a testament to our technological prowess and design excellence, serving as an encouragement for further technological innovation. We sincerely thank all those involved in the development, manufacturing, and implementation of this product, as well as the judges who provided valuable feedback and evaluations during the review process. About the "Industrial Design Award IDEA": Established in 1970 by the Nikkan Kogyo Shimbun, this award aims to promote design in Japanese industrial products. It is evaluated from multiple perspectives, including product functionality, appearance, marketability, social impact, and safety. The judging committee is composed of experts from relevant government ministries, universities, and industrial organizations, and this year marks the 55th edition of the award.