[Example] Particle-PLUS: 3D Opposing Target Type Putter
Introduction to Particle-PLUS Analysis Case: "Counter Target Type Putter (3D Analysis)" Simulation Case
This is an analysis case of a counter-target sputtering method, which is one of the film deposition techniques that causes low damage to the substrate. 3D calculations have a higher computational cost compared to 2D calculations, but they allow for simulations that take into account more complex shapes and their effects. ◇ Features of 'Particle-PLUS' - Specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, results can be obtained quickly without the need to simulate the entire device. - Excels in plasma simulations in low-pressure gases, where calculations using fluid models are challenging. - Supports both 2D and 3D, allowing for efficient analysis even with complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.
basic information
**Features** - The time scheme uses an implicit method, allowing for stable time evolution calculations over a large time step Δt compared to conventional methods. - The collision reaction model between neutral gas and electrons and ions employs the Monte Carlo Scattering method, enabling accurate and rapid calculations of complex reaction processes. - The neutral gas module determines the initial neutral gas distribution used in the above plasma module, allowing for quick evaluation of gas flow using the DSMC method. - The sputtered particle module analyzes the behavior of atoms sputtered from the target in plasma and neutral gas environments in magnetron sputtering devices, enabling rapid evaluation of flux distribution on opposing substrates. *For other functions and details, please feel free to contact us.*
Price range
Delivery Time
Model number/Brand name
Particle-PLUS
Applications/Examples of results
【Dual Frequency Capacitive Coupled Plasma】 - Optimization of voltage and other parameters to achieve high-density plasma - Damage to chamber walls - Optimization of power using external circuit models - It is possible to apply voltages to the electrode plates that align with real devices - The waveform of the applied voltage can be smooth and simulated with relatively realistic voltages - Calculations are relatively stable to avoid applying excessive voltages 【DC Magnetron Sputtering】 - Uniformity of erosion dependent on magnetic field distribution - Adsorption distribution of sputtered materials on the substrate 【Pulsed Voltage Magnetron Sputtering】 - Optimization of the application time of pulsed voltage to efficiently sputter materials 【Ion Implantation】 - The influence of the substrate on the erosion distribution 【Time Evolution of Applied Voltage on Electrode Plates】 - It is possible to observe physical quantities that are difficult to measure experimentally, such as electron density and ion velocity distribution - By investigating electron density and ion velocity distribution, it is possible to examine the uniformity of the film and damage to the chamber walls - By changing the calculation conditions, optimization of high-density plasma generation at low power is possible
