ADLINKジャパン 東京本社 Official site

The event hosted by AMD is a technology conference showcasing the latest products and solutions featuring AMD technology. AMD is holding this event with the aim of accelerating "trust" in AI together with its business partners and end users. ADLINK plans to exhibit its latest AMD-powered computer-on-module. ●Type 6 Compact module "cExpress-R8"

● Based on the NXP i.MX 95, it achieves AI performance of up to 2 TOPS. Compliant with SGeT SMARC 2.2 and OSM 1.2, it provides scalable and efficient edge intelligence. ● OSM-IMX95: A robust 45mm x 45mm solderable module adopting ADLINK's single-sided PCB design. It offers AI-driven performance for compact, power-constrained edge devices. ● SMARC LEC-IMX95: An 82 mm x 50 mm SGeT SMARC 2.2 module. Equipped with 10 GbE, secure boot, and industrial reliability, it enables intelligent IoT and automation. ● Providing customized high-performance edge solutions for various industries through diverse options and flexible ODM customization.

NVIDIA, a partner company of ADLINK Japan, will hold the "Latest Technology Session by NVIDIA Partners" at the 2025 Japan IT Week [Autumn], where ADLINK Japan's Kiuchi will present on the theme "Introduction to Embedded AI Solutions for TCO Reduction." This is an open seminar that is free and does not require prior registration, so please join us.

The event hosted by AMD is a technology conference that showcases the latest products and solutions featuring AMD technology. Through presentations by experts and interactive demonstrations, AMD's initiatives that lead cutting-edge technological trends in a wide range of fields such as manufacturing, AI, robotics, healthcare, automotive, aerospace, and defense will be introduced. There will also be opportunities for direct interaction with industry experts. The content is designed to provide an optimal opportunity for those involved in design and development to deepen their understanding of efficient application development using AMD's platforms and gain new insights. ADLINK is scheduled to showcase the latest AMD-based computer-on-modules, the "Type 6 Compact Module cExpress-R8" and the "Type 7 Basic Module Express-VR7." We look forward to your visit.

● AI-enabled high performance: Equipped with an integrated NPU and optionally compatible with NVIDIA GPUs, enabling scalable edge AI workloads. ● Modular I/O and flexible scalability: Supports function modules, spare signals, and extensive I/O customization to adapt to diverse application needs. ● Open-frame industrial design: Robust structure and wide operating temperature range allow for seamless integration into kiosks, machines, terminals, and more. ● High-quality display: Features industrial-grade AUO panels with ADLINK's unique customizations, including optical bonding, high brightness, anti-reflection, and UV protection.