ADLINKジャパン 東京本社 Official site

The event hosted by AMD is a technology conference that showcases the latest products and solutions featuring AMD technology. Through presentations by experts and interactive demonstrations, AMD's initiatives that lead cutting-edge technological trends in a wide range of fields such as manufacturing, AI, robotics, healthcare, automotive, aerospace, and defense will be introduced. There will also be opportunities for direct interaction with industry experts. The content is designed to provide an optimal opportunity for those involved in design and development to deepen their understanding of efficient application development using AMD's platforms and gain new insights. ADLINK is scheduled to showcase the latest AMD-based computer-on-modules, the "Type 6 Compact Module cExpress-R8" and the "Type 7 Basic Module Express-VR7." We look forward to your visit.

● AI-enabled high performance: Equipped with an integrated NPU and optionally compatible with NVIDIA GPUs, enabling scalable edge AI workloads. ● Modular I/O and flexible scalability: Supports function modules, spare signals, and extensive I/O customization to adapt to diverse application needs. ● Open-frame industrial design: Robust structure and wide operating temperature range allow for seamless integration into kiosks, machines, terminals, and more. ● High-quality display: Features industrial-grade AUO panels with ADLINK's unique customizations, including optical bonding, high brightness, anti-reflection, and UV protection.

●Equipped with AMD Ryzen Embedded 8000 series processors, achieving overwhelming performance. ●Accelerates multitasking and immersive visual experiences with 8-core, 16-thread processing powered by AMD RDNA 3 graphics. ●Achieves up to 40 TOPS of AI inference performance with Zen 4, RDNA 3, and XDNA architectures, enhancing on-device intelligence. ●Supports ECC-enabled DDR5 memory up to 96GB, ensuring reliable data integrity and system stability. ●Compatible with a variety of multi-display configurations (DP, eDP, HDMI, LVDS, VGA), flexibly accommodating complex visual setups.

●Wide voltage input: Supports 12-28V DC input, ensuring stable operation even in environments with unstable power. ●Balanced performance: Supports Intel Core CPUs with a maximum of 65W using PCIe 4.0, DDR4, and dual 2.5GbE. ●Ideal design for industrial applications: The Mini-ITX form factor and rich expandability enable seamless integration into embedded systems.

● Next-generation DLAP expandable edge AI platform: Built to meet the rapidly growing demand for edge AI solutions with flexible scalability and robust design. ● High-performance AI computing: Achieves scalable AI processing capabilities of up to 91.1 TFLOPS with support for NVIDIA RTX 6000 ADA GPU, enabling real-time decision-making at the edge. ● Versatile industrial applications: Optimized for mission-critical uses in manufacturing, healthcare, logistics, and smart cities, enhancing operational efficiency and intelligence.