●ADLINK announces the IPC platforms IAP & EVP, which have obtained global certification, to accelerate deployment across regions. ●ADLINK releases an integrated, globally compliant industrial PC with a pre-validated I/O ecosystem. ●ADLINK's new IAP & EVP platform accelerates OEM time-to-market with global certification support.

●ADLINK wins 7 products at the 34th Taiwan Excellence Awards: This demonstrates the company's advanced research and development capabilities in edge AI computing and intelligent applications. The award-winning products span industrial computers, AI platforms, and medical and transportation solutions, showcasing the company's comprehensive innovation strength. ●AI drives smart industries and accelerates modular innovation: Products such as the EMP-520, SP2-MTL, and Ampere Altra Dev Kit leverage high-performance AI inference and modular design to help companies expedite the adoption of smart manufacturing and automation applications. ●New milestones in smart transportation and medical applications: The ADM-AL30, AVA series, and MLC-S medical panel PC provide highly stable AI computing and robust security protection in autonomous driving, railways, and clinical medical environments, realizing a reliable intelligent ecosystem.

● Achieves up to 180 TOPS for complex edge AI workloads ● Simplifies system integration, especially for graphics-intensive applications, with Intel Arc GPU featuring up to 12 Xe cores ● Maximizes power efficiency and responsiveness with an advanced hybrid CPU architecture (P/E cores and LPE cores) combined with 128GB DDR5 memory ● Adds industrial temperature-rated SKUs. Equipped with IBECC memory and TSN Ethernet, ideal for mission-critical robust applications ● Implements Intel Core Ultra Series 3 in a compact COM-HPC Mini form factor, designed for space-constrained applications. Expected to be available in Q2 2026

●ADLINK won two awards at the 2025 Gartner Eye on Innovation Awards (Asia-Pacific), solidifying its leadership in advanced manufacturing utilizing AI. ●Built on the ADLINK Edge AI Agent Platform (EAAP), this edge agent AI, integrated with NVIDIA-certified AXE edge AI servers, NVIDIA RTX 6000 Ada generation GPUs, and NVIDIA Omniverse, enables proactive real-time manufacturing decision-making while ensuring the privacy of sensitive data. ●As a result, it has successfully improved Overall Equipment Effectiveness (OEE) by 80% and increased monthly production by 20%, supporting customers worldwide in achieving high-quality and stable advanced manufacturing.

ADLINK Technology announced today that it has successfully obtained IEC 62443-4-1 certification, an internationally recognized cybersecurity standard for industrial control systems. This significant achievement demonstrates that ADLINK has established an auditable, sustainable, and reproducible secure engineering framework throughout the secure product development lifecycle (SDL), reinforcing the company's commitment to providing safe, reliable, and highly resilient edge computing solutions to customers worldwide.

ADLINK Technology, a global leader in edge computing, has announced support for the Linux-based "Armadillo Base OS" (ABOS), developed by Atmark Techno and optimized for ADLINK's system-on-module (SoM). By combining ADLINK's high-density SoM with ABOS's embedded security features and long-term maintenance capabilities, IoT manufacturers can reduce development costs and shorten the time to market for secure IoT devices. Advancements in semiconductor technology have improved the performance of system-on-chip (SoC) devices, while also increasing the complexity of circuit board design. ADLINK's SoM integrates the processor, memory (including high-speed LPDDR4X/LPDDR5), and peripheral interfaces into a single module, simplifying carrier board design and reducing development effort.

The event hosted by AMD is a technology conference showcasing the latest products and solutions featuring AMD technology. AMD is holding this event with the aim of accelerating "trust" in AI together with its business partners and end users. ADLINK plans to exhibit its latest AMD-powered computer-on-module. ●Type 6 Compact module "cExpress-R8"

● Based on the NXP i.MX 95, it achieves AI performance of up to 2 TOPS. Compliant with SGeT SMARC 2.2 and OSM 1.2, it provides scalable and efficient edge intelligence. ● OSM-IMX95: A robust 45mm x 45mm solderable module adopting ADLINK's single-sided PCB design. It offers AI-driven performance for compact, power-constrained edge devices. ● SMARC LEC-IMX95: An 82 mm x 50 mm SGeT SMARC 2.2 module. Equipped with 10 GbE, secure boot, and industrial reliability, it enables intelligent IoT and automation. ● Providing customized high-performance edge solutions for various industries through diverse options and flexible ODM customization.

NVIDIA, a partner company of ADLINK Japan, will hold the "Latest Technology Session by NVIDIA Partners" at the 2025 Japan IT Week [Autumn], where ADLINK Japan's Kiuchi will present on the theme "Introduction to Embedded AI Solutions for TCO Reduction." This is an open seminar that is free and does not require prior registration, so please join us.

The event hosted by AMD is a technology conference that showcases the latest products and solutions featuring AMD technology. Through presentations by experts and interactive demonstrations, AMD's initiatives that lead cutting-edge technological trends in a wide range of fields such as manufacturing, AI, robotics, healthcare, automotive, aerospace, and defense will be introduced. There will also be opportunities for direct interaction with industry experts. The content is designed to provide an optimal opportunity for those involved in design and development to deepen their understanding of efficient application development using AMD's platforms and gain new insights. ADLINK is scheduled to showcase the latest AMD-based computer-on-modules, the "Type 6 Compact Module cExpress-R8" and the "Type 7 Basic Module Express-VR7." We look forward to your visit.

● AI-enabled high performance: Equipped with an integrated NPU and optionally compatible with NVIDIA GPUs, enabling scalable edge AI workloads. ● Modular I/O and flexible scalability: Supports function modules, spare signals, and extensive I/O customization to adapt to diverse application needs. ● Open-frame industrial design: Robust structure and wide operating temperature range allow for seamless integration into kiosks, machines, terminals, and more. ● High-quality display: Features industrial-grade AUO panels with ADLINK's unique customizations, including optical bonding, high brightness, anti-reflection, and UV protection.

●Equipped with AMD Ryzen Embedded 8000 series processors, achieving overwhelming performance. ●Accelerates multitasking and immersive visual experiences with 8-core, 16-thread processing powered by AMD RDNA 3 graphics. ●Achieves up to 40 TOPS of AI inference performance with Zen 4, RDNA 3, and XDNA architectures, enhancing on-device intelligence. ●Supports ECC-enabled DDR5 memory up to 96GB, ensuring reliable data integrity and system stability. ●Compatible with a variety of multi-display configurations (DP, eDP, HDMI, LVDS, VGA), flexibly accommodating complex visual setups.

●Wide voltage input: Supports 12-28V DC input, ensuring stable operation even in environments with unstable power. ●Balanced performance: Supports Intel Core CPUs with a maximum of 65W using PCIe 4.0, DDR4, and dual 2.5GbE. ●Ideal design for industrial applications: The Mini-ITX form factor and rich expandability enable seamless integration into embedded systems.

● Next-generation DLAP expandable edge AI platform: Built to meet the rapidly growing demand for edge AI solutions with flexible scalability and robust design. ● High-performance AI computing: Achieves scalable AI processing capabilities of up to 91.1 TFLOPS with support for NVIDIA RTX 6000 ADA GPU, enabling real-time decision-making at the edge. ● Versatile industrial applications: Optimized for mission-critical uses in manufacturing, healthcare, logistics, and smart cities, enhancing operational efficiency and intelligence.

●3.5 "Expanding the SBC Portfolio: ADLINK has announced the SBC35-MTL and SBC35-ASL, targeting both high-performance AI and robust embedded edge applications. ●AI Compatibility and Robust Design: The SBC35-MTL is equipped with an Intel Core Ultra featuring an NPU for real-time inference, while the SBC35-ASL is powered by the Intel Atom x7000RE, providing a wide temperature range and fanless operation. ●Flexible I/O with SBC-FM Modules: Both models support ADLINK's SBC-FM expansion modules, enabling customized I/O to accelerate deployment across various industries.

● High-Performance Computing: The EMP-520 series, equipped with the 14th generation Intel Core processor, delivers powerful processing capabilities, ensuring seamless multitasking and efficient management of heavy workloads. ● Excellent Visual Experience: With EDID emulation functionality, it supports simultaneous output of 4K video, providing vibrant and consistent displays ideal for dynamic digital signage environments. ● Reliable Design: The EMP-520 series is designed to withstand industrial environments, guaranteeing reliable operation 24/7, 365 days a year.

- Equipped with the Intel Core Ultra architecture featuring up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, offering both ultra power and energy efficiency. - 64GB of LPDDR5x memory is directly soldered onto the board, supporting maximum performance in a 95 x 70mm form factor, with an operating temperature range of -40°C to 85°C. - Integrated with up to 16 PCIe lanes, two SATA interfaces, two 2.5GbE Ethernet ports, and multiple DDI/USB4 and USB 3.0/2.0 interfaces for abundant I/O options.

This year, Japan's largest IT exhibition, "Japan IT Week," where cutting-edge IT solutions converge, will be renewed and held at Tokyo Big Sight. Our company will be exhibiting at the notable IoT and Edge Computing EXPO. At this exhibition, we plan to showcase in-vehicle camera solutions, real-time object detection x monocular depth estimation, edge AI, GPU solutions, edge computing, industrial panels and monitors, among others. We will also introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with five companies ★ 【TIER IV】 In-vehicle camera solutions 【Kansai University Graduate School of Comprehensive Informatics, Tanaka Laboratory】 Real-time object detection x monocular depth estimation 【ASK】 Portable external GPU 【Allxon】 Remote management of edge AI devices 【Macnica】 High-speed AI processing by Hailo

●ADLINK has partnered with LIPS to announce an AMR 3D x AI solution using NVIDIA Isaac Perceptor. This solution is designed for autonomous mobile robots with enhanced 3D vision, a wide FOV, and high resolution, surpassing LiDAR. ●This solution includes the LIPSAMR Perception DevKit equipped with the DLAP-411-Orin and LIPSedge 3D camera, providing high-precision 3D recognition for smart manufacturing and warehouse logistics. ●The ADLINK DLAP-411-Orin platform and the LIPSAMR Perception DevKit equipped with NVIDIA Jetson AGX Orin deliver 275 TOPS of AI performance and support multi-camera synchronization for complex multi-vision applications.

The MXE-230, equipped with the Hailo-8 AI accelerator, can achieve 26 TOPS of edge AI computing capability. The low-power MXE-230, which integrates the Hailo-8 AI accelerator, is particularly suitable for scenarios that require AI processing capabilities while being sensitive to power consumption. Hailo is a global leading provider of high-performance accelerators specifically designed to run complex AI models on edge devices.

●Supports MediaTek Genio 510, achieving intensive workloads and low power consumption ●Offers up to 8GB LPDDR4 RAM, up to 128GB eMMC, 4K graphics support, 30MP ISP camera, and a rich variety of I/O options ●Operates in temperatures from 40℃ to 85℃, enduring long-term mission-critical use with a 10-year lifecycle ●Size-L module compliant with OSM R1.1

- Breakthrough in Generative AI Performance: The DLAP Supreme series equipped with Phison's aiDAPTIV+ technology overcomes memory limitations and performance bottlenecks of edge devices, achieving 8 times the inference speed and 4 times the token length, supporting the training of generative language models. - Core Value of aiDAPTIV+ Technology: Phison's aiDAPTIV+ technology plays a crucial role in efficiently running large language models on devices with different memory configurations, enabling expansion to more application scenarios. - Close Collaboration Driving Industry Progress: ADLINK and Phison have been collaborating for over 10 years. The release of the DLAP Supreme series further promotes the adoption of AI in smart manufacturing, smart cities, and other industries.

● ADLINK's NVIDIA Jetson Orin platform is compatible with NVIDIA JetPack 6.1, enhancing performance, security, and efficiency. ● The upgraded libraries and enhanced system services optimize AI visual analysis and generative AI application development. ● The ADLINK Edge AI platform, ideal for smart industries, offers unparalleled flexibility and robust computing power.

●Compact and Versatile: The EMP-100 is an industrial NUC (Next Unit of Computing) device equipped with dual 4K display capabilities, designed for space-saving use in both smart retail and industrial environments. ●Advanced Features: Powered by an Intel Celeron processor, it includes IoT connectivity, an M.2 expansion slot, and dual HDMI outputs, supporting digital signage, interactive kiosks, and AI/IoT applications. ●Industrial: Built to withstand harsh environments, it supports tasks such as real-time machine monitoring, IoT gateway functionality, and basic surveillance, making it ideal for automated production and edge computing.

● Supports 14th/13th/12th generation Intel Core i9/i7/i5/i3 and Intel N97 processors, enabling flexible performance options. ● High-speed capabilities with PCIe 5.0 x16, DDR5, and 2.5GbE PoE to accommodate high-performance applications. ● Versatile integration with abundant I/O options including RS-232/422/485, USB 3.2 Gen2, and M.2 slots.

● The EMP-100 industrial fanless mini PC (digital signage player) is suitable for various applications such as retail, restaurants, shopping complexes, and factories. It supports dual 4K displays and is equipped with multiple connectivity options and expansion interfaces. ● The fully waterproof stainless steel touch panel Titan2 is specially designed for applications in food processing, pharmaceuticals, chemicals, mining, and automation. It features an IP69K rated waterproof and dustproof case, meets stringent hygiene standards, and can withstand high-pressure hot water cleaning. ● ADLINK Technology is committed to integrating technological innovation with market needs, and by providing comprehensive industrial automation solutions globally, it is driving the acceleration of digital transformation across the industry.

On November 7, 2024 (Thursday), the "Arm Tech Symposia Tokyo" will be held at the Tokyo Conference Center, Shinagawa. This event will feature keynote speeches, panel sessions, and breakout sessions by Arm executives and guest speakers, and ADLINK plans to showcase a variety of Arm-based products. 【Exhibited Products】 OSM Module【OSM-IMX93】 COM-HPC Module【COM-HPC-ALT】 SMARC Module【LEC-IMX95】 Development Kit【I-Pi SMARC IMX8MP】 Development Kit【I-Pi SMARC RB5】 Development Kit【I-Pi SMARC 1200】 IoT Gateway【MXA-200】 Ampere Altra Developer Platform【AADP】

● Ecosystem Partnership: ADLINK and SimProBot have signed a memorandum of understanding (MOU) to build on-premises AI workstation solutions for enterprises. ● Ideal for enterprise on-premises applications: Efficient, secure, and user-friendly design. Specialized for corporate clients to protect industry know-how and trade secrets. ● End-to-end solution for rapid delivery: Accelerates the digital transformation of industrial automation for enterprises by fully integrating hardware and software.

● New ADLINK SBC35 Series: A compact 3.5-inch single-board computer designed for applications with space constraints. ● Robust processing options: Equipped with Intel N97 optimized for efficiency and high-performance 13th generation Intel Core i7/i5/i3/Celeron options. ● Wide connectivity and innovative expandability: Offers diverse native I/O capabilities and customizable SBC-FM function modules to enhance I/O expansion.

● The cost-effective ATX motherboard is optimized for your budget while providing essential performance and uncompromising reliability. ● It supports a wide range of Intel Core processors and accommodates diverse applications in various environments. ● It features robust connectivity with extensive I/O capabilities for industrial applications such as warehouse management, industrial automation, smart manufacturing, and new energy.