●A short-sized module based on the MediaTek Genio 1200 processor, designed to drive AIoT and 4K graphics applications at the edge, compliant with the SMARC 2.1 specification. ●It features a 2.2GHz octa-core (Cortex-A78 x4 + Cortex-A55 x4) CPU, a 5-core GPU for advanced 3D graphics, an integrated APU (AI Processor Unit) for on-device AI, and supports multiple 4K displays and camera inputs, all configured for excellent power efficiency.

ADLINK Technology announced today a strategic investment by TTTech Auto in the independence of its new company, ZettaScale Technologies, which focuses on middleware development for robotics and autonomous vehicles. This investment is subject to regulatory approval and provides a solid foundation for commercializing open-source software specialized in edge computing, robotics, and V2X, developed over the past five years at ADLINK's advanced technology office in Paris.

【ADLINK Presentation Date and Time】 ◆ Date and Time: June 24 (Friday) 14:00～ ◆ Presentation Title: Edge AI Vision Solutions ◆ Speaker: Kazuhiko Oguchi, Branch Manager, ADLINK Japan West Japan Branch 【Presentation Content】 ADLINK's Edge AI Vision Solutions integrate hardware and software to easily deploy machine vision for AI-based applications. We provide a full range of AI-enabled machine vision platforms, including AI-compatible vision platforms, smart cameras, modules, and inference servers, dramatically reducing the time-consuming processes of integration, validation, and development for AI developers. 【Booth Introduction】 At ADLINK's booth, we showcase an all-in-one smart camera (NEON) equipped with the Jetson series, a multi-channel AI vision system (EOS-JNX) that supports various application scenarios, and edge computing visual analysis software (EVA SDK) that supports the development of edge AI vision projects. Product catalogs and case studies are also available for download.

ADLINK Japan's West Japan Branch Manager, Kazuhiko Oguchi, will speak at the online seminar on Day 2 of the limited-time event "Intelligent 5G Summit" hosted by Intel Corporation, which will take place from June 6 (Monday) to June 10 (Friday), 2022. 【ADLINK Presentation Schedule】 Day 2: International Efforts to Enhance Intelligent Edge ◆ Date: June 9 (Thursday) ◆ Time: 15:15 - 15:35 ◆ Presentation Title: Enhancing Private Networks and Industrial IoT (AMR) with 5G ◆ Speaker: Kazuhiko Oguchi, West Japan Branch Manager, ADLINK Japan 【What is the Intelligent 5G Summit?】 The amount of data handled at the edge and in the cloud is increasing exponentially. To utilize this data, the next-generation high-speed communication standard, 5G, allows for the movement of large volumes of data with low latency and high speed. This capability is being utilized not only for communication on smart devices, represented by smartphones, but also in industries and medical fields where real-time communication is required, facilitating the exchange of large amounts of data with low latency and high speed.

● Conducted pre-validation on ADLINK's MECS series platform to ensure system performance and stability of the 5G acceleration solution. ● Adopted by many mobile communication operators, passed rigorous pre-deployment tests, applied to formal projects, and capable of rapid market entry. ● Compared to FPGA, the PCIe-ACC100 offers a higher performance and more cost-effective FEC accelerator card solution.

ADLINK has announced a COM HPC-based Ampere Altra workstation that is Arm SystemReady SR certified. The ADLINK COM HPC Ampere Altra Developer Platform is available in various configurations including 32/64/80 cores. The Ampere Altra development system is a developer-oriented system based on the Ampere Altra SoC using the Arm Neoverse N1 platform, combining server-class computing power with extremely high scalability. This system supports up to 80 Arm v8.2 64-bit cores at 2.6GHz, with a power consumption of just 150W TDP.

ADLINK's alliance partner, Marubun Corporation, will be exhibiting at the Japan IT WEEK Spring "Embedded Edge Computing Expo" held from April 6 to April 8. At the Marubun booth, a variety of ADLINK products will be showcased, including a live demo of the "TIER IV x ADLINK Autonomous Driving Solution" (TIER IV's HDR camera x ADLINK's ROS 2 compatible robot controller) in collaboration with TIER IV, which is a highlight of the exhibition. Additionally, we will also be demonstrating BOX PCs and COM modules equipped with the latest Intel CPUs and NVIDIA GPUs, as well as demos utilizing embedded software related to edge AI, allowing visitors to see solution examples that combine hardware and software. We look forward to your visit.

- A vision system equipped with NVIDIA Jetson Xavier NX that supports 4-channel PoE cameras, providing PoE functionality and digital I/O optimized for industrial AI inference. - Smart PoE, PoE loss detection features, and watchdog indicator design reduce maintenance efforts with easy management. - Optimized OS with GigE dedicated bandwidth (EOS-JNX-G) and 100m cable validation ensures capture performance for non-stop operations in quality assurance utilizing AI. - Designed as an AI PoE hub with an uplink port for existing NVRs (Network Video Recorders), enabling easy implementation of safety AI for various applications such as smart cities. - Support for ADLINK's proprietary EVA SDK enables rapid deployment of AI applications with an intuitive GUI and rich plugin options, accelerating proof of concept and reducing time to market.

●This partnership evolves AI technology through a shared commitment to focus on intelligent video management and support the acceleration of edge AI vision solution deployment. ●With the solutions from ANSCENTER and ADLINK, users can leverage computer vision technology to establish self-regulating environments. ●This solution enables intelligent analysis and control capabilities within existing manufacturing systems.

- Two new modules for embedded and rugged applications equipped with Intel Xeon D processors (development codename: Ice Lake-D), featuring industrial-grade reliability and extended temperature ratings. - COM-HPC-sIDH server-type module - Express-ID7 Type 7 module - Integrates up to 8 x 10G or other configurations of high-speed Ethernet, combined with up to 32 PCIe Gen4 lanes, achieving instantaneous responsiveness and performance. - Equipped with Intel TCC, Deep Learning Boost (VNNI), and AVX-512, optimizing and accelerating AI performance, supporting TSN (Time Sensitive Networking) for precise control of hard real-time workloads across all devices on the network.

● ADLINK's latest model AMP is a 4-axis motion controller card that supports PCI Express interface, a pulse output rate of up to 10MHz, and 64 channels of GPIO. ● ADLINK's AMP-104C/AMP-304C series integrates hardware and software to meet various automated motion requirements in semiconductor, AOI, EMS, LED, and PCB applications. ● ADLINK's APS SDK motion control software supports all ADLINK motion controllers with a single user interface, featuring over 400 APIs.

● The advanced hybrid architecture features up to 6 Performance Cores (P-cores) to enhance single-thread throughput for IoT workloads, and up to 8 Efficient Cores (E-cores) for background task management and multitasking. ● It integrates Intel Iris Xe graphics architecture with up to 96 execution units, supporting four independent 4K60 HDR displays and providing excellent AI performance with Intel Deep Learning Boost. ● Integrated USB4/TBT4 and multiple PCIe Gen4 lanes enable high-speed data transfer and support for class-leading peripherals.

●This strategic partnership leverages ADLINK's over 20 years of experience in robust embedded computing for mission-critical applications and Pixus's deep expertise in military-standard compliant designs for system backplanes and chassis platforms. ●Both companies will jointly develop a Proof of Concept (PoC) demo of OpenVPX compliant with SOSA and collaborate with global system integrators to develop advanced C4ISR applications. ●ADLINK's SOSA-compliant OpenVPX building blocks include the industry's first 3U VPX blade "VPX3-TL" equipped with an Intel Tiger Lake processor.

The LEC-RB5 SMARC is a high-performance module equipped with the Qualcomm QRB5165 processor, enabling on-device AI and 5G connectivity for consumer, enterprise, and industrial robotics. It features a high-performance NPU, an octa-core (Arm Cortex-A77 cores x8) CPU, low power consumption, and support for up to six cameras. The Qualcomm QRB5165 processor, customized for robotic applications, is designed to efficiently execute complex AI, deep learning workloads, and edge inference on-device with low power consumption.

Riyoh Electro, which has led the development of visual computing solutions and provided them to the market in collaboration with many partners, and NVIDIA will host an online live broadcast from November 24 (Wednesday) to 26 (Friday), 2021, inviting industry experts to share the latest trends, technologies, and solutions through lectures and panel discussions. On DAY 1, the Edge Computing DAY, our representative Kiuchi will take the stage. Don't miss the presentation titled "Introduction to Robotics Solutions Utilizing NVIDIA Jetson-based Products and ROS"!

● ADLINK's EGX-MXM-A1000, EGX-MXM-A2000, and EGX-MXM-A4500 are the first modules to adopt NVIDIA's embedded GPU based on the NVIDIA Ampere architecture. ● ADLINK's MXM graphics modules provide high-performance GPU acceleration in a compact and power-efficient MXM form factor, bringing edge computing and embedded AI to many vertical markets such as healthcare, manufacturing, and transportation. ● Robust design that withstands harsh temperature environments, shock, vibration, and corrosion under severe conditions.

●ADLINK's compact and rugged AI-enabled AVA-RAGX is built on the latest industrial version of the NVIDIA Jetson AGX Xavier module with 32 TOPS, providing reliability and performance for railway applications in demanding and harsh operating environments. ●AVA-RAGX expands ADLINK's portfolio of EN 50155 compliant AVA platforms, offering railway solution providers the flexibility to choose the optimal configuration for digital transformation. ●ADLINK continues its "Elite" partnership with NVIDIA to leverage the power of infrastructure edge AI to build advanced railway solutions.

ADLINK is working with its ecosystem partners Askey, the Taiwan Industrial Technology Research Institute (III), and EOI to develop and deploy an integrated C-V2X (Cellular Vehicle to Everything) solution that significantly improves traffic safety and efficiency. This collaboration leverages ADLINK's deep expertise in the development and deployment of AI-enabled onboard computers, 5G private networks, 5G edge servers, and intelligent edge infrastructure. ADLINK and its partner companies are conducting pilot projects across Taiwan to test various use cases with different implementation methods and application requirements.

ADLINK provides support for AI-focused computing platforms and open-source software for the first autonomous racing car competition, the "Indy Autonomous Challenge (IAC)," where universities from around the world compete for a prize of $1 million at the Indianapolis Motor Speedway. As the official edge computing sponsor of the IAC, ADLINK will supply the AVA-3350 series onboard computing robot controllers to the 10 racing teams that pass the qualifying rounds. Through collaboration with the Autoware Foundation, Boston Dynamics, GAIA Platform, and Kvaser, various interactive demonstrations will be held at the STEM Garage.

Under the theme of "Visualization at the Edge," experts in edge computing combining AI, visualization, and autonomous mobile technology will engage in detailed discussions on smart healthcare, smart transportation, smart manufacturing, and smart enterprise applications. This event aims to create opportunities for cross-disciplinary collaboration, develop total solutions, and co-create ecosystems. We invite you to participate in this opportunity to clarify the most important strategies and explore the infinite possibilities of 5G and AI. (All sessions will be conducted in English with English subtitles.) In four keynote speeches by industry leaders AUO, ADLINK, Intel, and ARM, industry trends, technologies, and future visions will be discussed. More than 20 speeches will delve deeply into technology development, practices, and market opportunities. Don't miss this opportunity. We will showcase products, technologies, and solutions provided by AUO, ADLINK, and over 10 partners, accelerating digital transformation with the latest solutions.

●ADLINK's proprietary 80-core Arm-based COM-HPC server-type module sets a new standard ratio for edge performance and power. With up to 80 ArmV8.2 64-bit cores, a maximum of 2.8GHz, and moderate power requirements at 175W TDP, users can reliably and predictably handle compute-intensive workloads. ●The COM-HPC Ampere Altra complies with Arm SystemReady SR, allowing for immediate support of many standard operating systems, hypervisors, and software. ●ADLINK has built a super-quiet water-cooled tower system called the "AVA Developer Platform," which comes with a default of 32 cores based on the COM-HPC Ampere Altra module and its carrier. The COM-HPC Ampere Altra module is also included in the "AVA-AP1," a high-durability vehicle prototyping platform co-developed by ADLINK, Arm, and Ampere, which features a default of 80 cores.

● The new portal enhances the remote management capabilities of ADLINK's deep learning acceleration platform, the "DLAP-211 series." ● Real-time system information and timely alerts enable immediate response from remote locations. ● Monitoring, alerts, and updates are enhanced by Allxon Device Management Solutions (Allxon DMS).

The ADLINK EVA SDK is an AI (artificial intelligence) edge visual analysis software platform that supports AI models optimized by TensorRT, OpenVINO, and ONNX Runtime, enabling AI developers, AI software companies, and enterprise system integrators (SI) to develop AI vision proofs of concept (PoC) in just two weeks. Since the software platform is pre-installed on ADLINK's AI vision hardware, it facilitates the development of edge AI vision applications with an intuitive GUI and ready-to-use plugins, allowing users to focus on training and integrating AI models. The EVA SDK is a one-API framework that supports open-source plugins for each stage of AI vision projects, including image capture and preprocessing, AI inference, post-processing, and analysis.

Prior to the international ROS developer conference ROSCon 2021, the official local ROSCon event, ROSCon JP 2021, will be held in Tokyo. ROSCon JP 2021 is organized by the general incorporated association ROSCon JP in collaboration with Open Robotics. ROSCon JP 2021 will provide a full day of learning about the latest topics in ROS, offering a great opportunity for all ROS developers, from beginners to experts, to engage with the Japanese ROS community. Participants will be able to hear and learn from various technical talks by experts, as well as discussions that only ROS enthusiasts would know, and exchange ideas with fellow developers. ADLINK will showcase robot controllers and demo units in collaboration with Kudan at the booth corner. We look forward to your participation.

● The 3U VPX module is based on the 11th generation Intel Core i7 processor technology (formerly codenamed Tiger Lake-H), enhancing data and graphics performance as well as artificial intelligence (AI) acceleration capabilities. ● The design compliant with the Sensor Open System Architecture (SOSA) allows for easy reconfiguration and upgrades, providing a cost-effective, rapidly developed and deployed, non-proprietary, and open architecture for embedded computing capabilities. ● Based on the principles of the Module Open System Approach (MOSA), ADLINK actively collaborates with partners to develop custom-made COTS products based on open standards, enabling system integrators in the aerospace and defense sectors to bring products to market quickly.

●ADLINK's Express-TL COM Express Type 6 module is equipped with up to 8-core 11th generation Intel Core, Xeon W, and Celeron 6000 processors, as well as 128 GB of memory. ●The Express-TL is the first COM Express module to support PCI Express Gen 4x16, efficiently providing twice the bandwidth of traditional COM Express modules. ●The Express-TL is designed to operate in harsh temperatures ranging from -40°C to 85°C, making it suitable for continuous use in industrial environments for 24 hours a day over 10 years.

●ADLINK has joined the O-RAN Alliance as a contributor member, promoting technological innovation in 5G radio access networks (RAN) as well as the integration of hardware and software for open interface-driven disaggregated networks. ●Leveraging its successful experience in developing 5G multi-access edge computing (MEC) edge servers, NVIDIA GPU Cloud (NGC)-Ready solutions, AWS IoT Greengrass validated solutions, and Intel IoT RFP Ready Kit (RRK) certified edge solutions, ADLINK contributes to the active expansion of the ecosystem. ●ADLINK will continue its collaboration with other O-RAN members such as SageRAN, Toolsensing, and Arraycomm to develop rapid deployment 5G RAN solutions based on best-of-breed O-RAN compliant white box platforms.

The ultra-compact edge DAQ solution "MCM-216/218" for voltage and current measurement functions as a standalone edge device that does not require a host PC. The MCM-216/218 is based on the ARM Cortex-A9 processor and features built-in 16 or 8 channels of 16-bit analog voltage or current inputs, making it suitable for 24/7 sensor measurement and condition monitoring IIoT applications. The MCM-216/218 supports distributed and remote data acquisition, edge analytics, monitoring control, and data acquisition (SCADA).

● The cPCI-A3525 complies with the latest PICMG CPCI-S.0 CompactPCI Serial Rev. 2.0 standard, providing enhanced performance. ● The robust and SWaP-optimized 3U module is ideal for next-generation mission-critical applications in railway transportation, aerospace and defense, and industrial automation. ● The addition of the cPCI-A3525 to ADLINK's extensive CompactPCI product line demonstrates the company's continued commitment to technology.

ADLINK Japan will exhibit at "NVIDIA AI DAYS," and on DAY 2 at 2 PM, our West Japan Branch Manager, Kazuhiko Oguchi, will take the stage. The adoption of Edge AIoT is progressing, with expectations for improvements in performance, productivity, and efficiency across various fields. To successfully implement Edge AIoT, developers face countless difficult choices regarding hardware, networks, frameworks, and more. Furthermore, executing AI at the edge rather than in the cloud gives new meaning to robustness and presents additional challenges for developers. This session will introduce various case studies for developing Edge AIoT. At the ADLINK booth, you can see optimized heterogeneous computing solutions that can accelerate AI workloads and meet a wide range of embedded requirements based on high performance, long lifecycle, power consumption, and form factor, including Quadro-based embedded MXM modules, edge AI platforms, Jetson-based edge computing, and Xavier-based ROS 2 compatible robot controllers.