The compact 45mm x 45mm Open Standard Module (OSM) streamlines production with a modular system that has no overhead, providing 662 pins for miniaturization and enhancement of IoT applications. ADLINK is a pioneer of the OSM form factor, offering the OSM-IMX93 and OSM-IMX8MP, each equipped with the NXP i.MX 93 and NXP i.MX 8M Plus, respectively, demonstrating continuous breakthroughs in embedded computing.

ADLINK announces the AVA-7200, AVA-1000, and Passenger Information Display System (PIDS), leading railway technology. The AVA-7200 and AVA-1000 enhance the safety, efficiency, and connectivity of railway operations through advanced AI computing capabilities. The PIDS offers selectable display solutions using AUO's TARTAN display technology, addressing the diverse needs of the railway industry.

● Efficient Edge Device Management: ADLINK's EdgeGO provides an all-in-one software solution for the remote and secure management of edge devices across various industries. ● Improved Operational Efficiency: Real-time alerts, remote troubleshooting, and comprehensive device monitoring enable efficient and secure operations. ● Optimized for Various Fields: EdgeGO caters to sectors such as manufacturing, smart cities, healthcare, and retail, ensuring optimal performance and device management.

● Industrial ARM-based panel PC equipped with a high-performance NXP i.MX8M Plus processor, featuring a 32GB built-in multimedia card (eMMC) and an external Micro SD slot for storage expansion. ● Flexible configuration: modularity, speed, energy efficiency, excellent connectivity, long lifespan. ● Assisting system integrators, integrated solution providers, and brand vendors to quickly deliver cutting-edge features for individual HMI applications. ● Previewed at Embedded World 2024, recognized for design excellence, relative performance, and market impact, and awarded Best In Show.

ADLINK will collaborate with NAVER LABS to enhance autonomous mobile robot (AMR) technology, focusing on the development of the innovative robot "Rookie." This partnership aims to merge ADLINK's advanced hardware expertise with NAVER LABS' cutting-edge AI and robotics research, driving innovations in efficiency, safety, and adaptability in industrial environments. Both companies are committed to the continuous advancement of AMR technology, along with future development plans aimed at further revolutionizing automation and robotics.

The ASD+ Enterprise Series, designed for data-intensive applications such as data centers, AI-driven projects, and autonomous vehicle data loggers, guarantees top performance and unwavering reliability. These SSDs, available in 2.5-inch SATA, M.2 M Key, and U.2 PCIe form factors, feature PCIe Gen4 and 3D-TLC flash, offering a wide range of capacities with a 5-year warranty. With robust security measures including TCG-OPAL compliance, the ASD+ series protects sensitive data in enterprise environments.

ADLINK has announced the A380E, the first graphics card based on Intel GPU, featuring excellent performance and compatibility with the ADLINK gaming platform. The A380E not only demonstrates its capabilities in commercial gaming but also extends its usefulness to edge AI applications by leveraging the powerful support of the OpenVino AI toolkit. This integration allows the A380E to streamline AI development and seamlessly incorporate deep learning capabilities.

●ADLINK announces two new modules, COM Express and SMARC, equipped with the latest Intel Atom processors. ●With soldered memory and extreme temperature options, this module can meet various high-performance, low-power, and robust edge solutions that operate 24/7. ●Supporting Intel TCC and Time Sensitive Networking (TSN), this module is suitable for hard real-time computing workloads required in use cases such as industrial automation, AI robotics, smart retail, transportation, and network communications.

This year, Japan's largest IT exhibition, "Japan IT Week [Spring]," where cutting-edge IT solutions gather, will be held at Tokyo Big Sight. Our company will be exhibiting at the 13th IoT Solution Expo [Spring], which is particularly noteworthy. At this exhibition, we plan to showcase edge IoT manufacturing solutions, edge AI, GPU solutions, edge computing, industrial panels & monitors, and more. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with three companies ★ (ADLINK x Allxon) Allxon's remote monitoring & management platform (ADLINK x Ataya) MicroRAN solution (ADLINK x Sric) Real-time GPS operation management system

ADLINK adds support for the 14th generation Intel Core processors to its main product line, enhancing the performance and AI capabilities of diverse computing systems. This upgrade includes the IMB-M47, IMB-M47H motherboards, and NuPRO-E47 SBC, with the MVP-5200/MVP-6200 series scheduled for release in late 2024. The upgrade to the 14th generation processors demonstrates ADLINK's commitment to innovation in edge computing and AI, providing customers with advanced and future-proof technology.

ADLINK will launch the Titan2 series of industrial panel PCs made of stainless steel, compliant with IP69K, designed for harsh industrial environments. With a corrosion-resistant chassis, 11th generation Intel Core processors, and M12 connectors, it achieves stability, hygiene, and seamless IIoT integration. With customizable options and powerful computing, the Titan2 is ideal for food processing, pharmaceuticals, and automotive production.

● IIoT gateway equipped with the high-performance, low-power NXP i.MX 8M Plus processor ● Robust, fanless, wireless-enabled, 5G compatible ● Ideal for smart manufacturing, renewable energy, and smart cities

This year, the largest exhibition in the Kansai region covering IT, DX, and digital fields, the "8th Japan IT Week [Kansai]," will be held at Intex Osaka. ADLINK Japan will participate in the Embedded/Edge Computing Exhibition, where essential embedded technologies for the development and control of various electronic devices will be showcased. At ADLINK's booth, we plan to display embedded graphics solutions, edge computing, edge IoT manufacturing solutions, edge AI vision, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ Collaboration demos with three companies will be showcased ★ (ADLINK x Marubun) Portable GPU Pocket AI solution (ADLINK x Allxon) Jetson-equipped edge AI remote monitoring and management platform (ADLINK x Daitron) AI solution for operational monitoring ★ Featured solutions ★ Portable GPU Edge AI platform Machine vision Panels and monitors

The COM Express module "cExpress-MTL" equipped with Intel Core Ultra integrates up to 8 Xe cores (128 EUs), an NPU, and 14 CPU cores (6P+8E), providing 1.9 times the GPU performance of the previous generation with a TDP of 28W, along with dedicated AI acceleration that reduces power consumption. By utilizing Intel's modular architecture's low-power E cores, Intel Core Ultra achieves 30-50% higher power efficiency compared to the 13th generation Intel Core processors. ADLINK's cExpress-MTL module effectively simplifies the design of solutions requiring graphics and AI for applications such as portable medical ultrasound devices, industrial automation, autonomous driving, and AI robotics, leveraging graphics and AI capabilities without the need to connect to external components, along with hardware-accelerated AV1 encoding/decoding.

ADLINK's latest COM Express Basic Size Type 7 module, the Express-VR7, achieves 8 cores, 15W, and a TDP of 45W, providing the best performance per watt, complemented by exceptional responsiveness with 64GB dual-channel DDR5 SO-DIMM. It integrates two 10G Ethernet ports and 14 PCIe Gen4 lanes, making it an ideal solution for various networking and data processing applications with extreme temperature options (-40°C to 85°C). ADLINK's Express-VR7 supports use cases such as edge networking devices, 5G, signal processing, industrial automation and control, and robust edge servers.

● The new industrial ATX motherboard supports 12th/13th generation Intel Core processors. ● Equipped with seven PCIe slots, PCIe 5.0, DDR5, and 2.5GbE, it supports faster performance, large capacity, and next-generation GPUs. ● Ideal for industrial automation, machine vision, factory automation, and logistics.

● The EMU-200 series comes with a built-in EGiFlow web console, simplifying data communication across different network systems. ● It supports major industrial communication protocols, meeting cross-industry requirements. ● It offers a rich variety of I/O interfaces and wireless support, making it suitable for monitoring decentralized or unmanned sites. ● It accommodates a wide temperature range of 40 to 70°C and can adapt to many harsh environments with diverse installation options.

●The ROScube-X RQX-59 series has won the 2023 IoT Edge Computing Excellence Award. ●ROScube is a highly versatile family of robot controllers specially developed for robots equipped with AI, seamlessly integrating with ROS 2 and its vast ecosystem, making it ideal for AMR and autonomous driving solutions. ●The award-winning RQX-59 series is equipped with the NVIDIA Jetson AGX Orin module and can synchronize frames from LiDAR and up to 8 GMSL2/FPD-Link III cameras.

●The ROScube-X RQX-59 series is designed based on the NVIDIA Jetson AGX Orin module, offering a sixfold improvement in AI performance compared to the previous generation. ●ROScube is a versatile modular robot controller family equipped with NVIDIA Jetson modules, designed for robotics and autonomous driving applications specialized in AI, as part of an embedded edge AI platform. ●The ROScube family provides seamless scalability, addressing a wide range of solution requirements across various industries. ●The ROScube family offers comprehensive extension support in the form of sources developed with the NVIDIA JetPack SDK and ADLINK's Neuron SDK, facilitating seamless integration and development.

●Here are the specifications for ADLINK's COM-HPC-cRLS client-type Size C module equipped with the 13th generation Intel Core processor: o Up to 13th generation Intel Core i9 processor, 16 Performance-Cores, 8 Efficient-Cores, and 32 threads o Up to 128GB DDR5 SODIMM at 4000MT/s, and 36MB cache (an increase of 6MB compared to previous models) o PCIe Gen5 x16, 2.5GbE LAN x 2 ●COM-HPC-cRLS supports Intel TCC and Time Sensitive Networking (TSN), making it suitable for hard real-time computing workloads required in applications such as industrial automation, semiconductor equipment testing, and AI robotics.

The SuperCAT series overcomes hardware limitations, supporting synchronous control of up to 128 axes and cycle times ranging from 4ms to 125μs. The SuperCAT series facilitates the integration and simultaneous development of motion control, machine vision, and data analysis. Cost-effective solutions through flexible hardware configurations and software function options. One-stop shopping including EtherCAT main devices and sub-device modules compatible with over 30 partners.

●Unmatched Performance: Equipped with 12th/13th generation Intel Core i9/i7/i5/i3 processors, achieving class-leading performance. ●Ultimate Flexibility: Modular and scalable design that is easy to expand, with optional FM modules to meet domain-specific requirements. ●AI-Ready Edge Platform: With built-in GPU power and machine vision capabilities, the ADLINK MVP-5200/6200 can instantly deploy AI-enabled applications.

●ADLINK and Riyo Electro have launched "Pocket AI" in Japan ●Equipped with NVIDIA RTX A500 ●Pocket-sized portable GPU acceleration ●A powerful alternative source for GPUs ●Elevating performance and mobility to a new dimension ●Software and hardware compatibility ●Over 100 TOPs of high-density INT8 ●For x86 + Windows/Linux users ●High-throughput Thunderbolt 3 interface enables universal connectivity and accelerated data transfer

●Easy Deployment: The slim and lightweight frame design allows for effortless integration and installation tailored to various spaces and applications. ●High Visibility: The wide-viewing angle 16:9 LCD panel and fingerprint-resistant coating ensure clarity. ●Smooth User Interaction: Supports 10-point multi-touch with projected capacitive (PCAP) technology, allowing for smooth operation of gestures such as zoom, flick, rotate, swipe, drag, pinch, press, and double-tap. ●High Durability: The AUO Display Plus direct sales industrial-grade panel, protected by a 7H hardness and IP65 front panel, can easily withstand environmental hazards such as water and dust ingress, scratches, abrasions, and metal particles. ●Wide Range of Size Options: The OM series offers panel sizes of 10.1 inches, 15.6 inches, 18.5 inches, 21.5 inches, 23.8 inches, 27.0 inches, 32.0 inches, and 43.0 inches, while the IM series provides 21.5 inches, 23.8 inches, and 27.0 inches tailored to customer needs.

●Multi-display: Supports four independent displays (FHD/4K/8K) for media playback. ●Excellent edge computing: Advanced Intel processor (Tiger Lake-UP3) delivers high performance for IoT. ●Convenient and well-thought-out design: Compact size, rich I/O and expansion interface support, wireless module (optional). ●Industrial-grade reliability: Fanless design and robust build quality ensure continuous hassle-free system operation.

● The ASD+ Series offers industry-leading reliability with a wide range of operating temperature options. ● Security features and power outage measures protect data and access. ● High-quality original ICs with a 3-year warranty.

● Pocket-sized portable GPU acceleration ● Powerful alternative source of GPU ● Elevating performance and mobility to a new dimension ● Software and hardware compatibility ● Over 100 TOPs of high-density INT8 ● For x86 + Windows/Linux users ● High-throughput Thunderbolt 3 interface enables universal connectivity and fast data transfer

● The new ATX motherboard supports 12th/13th generation Intel Core, Pentium, and Celeron processors. ● Scalable high performance with sufficient I/O and high-speed interfaces provides various features and performance that enhance the use of high-performance cards integrated into complex processing tasks such as smart manufacturing, 5G manufacturing, semiconductors, and machine vision applications. ● The IMB-M47H is currently available for a limited quantity for certified customers and is ready for testing.

●ADLINK's MicroRAN 5G private network provides an economical turnkey solution for small and medium-sized enterprises. ●ADLINK, Askey, and Ataya promise to collaboratively build and develop an all-in-one solution as strategic partners to support companies' intelligent transformation. ●The MicroRAN 5G private network solution will initially be deployed in Taiwan, focusing on smart manufacturing, and will then target the Asia-Pacific region before expanding to the global market.

- Hybrid PLC with customizable HMI vector graphic interface and PC-based software motion control achieves low TCO, easy integration, and high scalability. - 125μs EtherCAT control cycle, up to 128-axis motion control with ADLINK's proprietary SuperCAT, and support for APS function library. - Compatible with Modbus and CANopen automation protocols, enabling seamless communication with over 90% of PLC drivers. - Automatic recording of production data by data logger and immediate push notification service for rapid troubleshooting. - High reliability and optimized cloud service connection for IoT applications via OPCUA, MQTT, and RESTful API.