● The new industrial ATX motherboard supports 12th/13th generation Intel Core processors. ● Equipped with seven PCIe slots, PCIe 5.0, DDR5, and 2.5GbE, it supports faster performance, large capacity, and next-generation GPUs. ● Ideal for industrial automation, machine vision, factory automation, and logistics.

● The EMU-200 series comes with a built-in EGiFlow web console, simplifying data communication across different network systems. ● It supports major industrial communication protocols, meeting cross-industry requirements. ● It offers a rich variety of I/O interfaces and wireless support, making it suitable for monitoring decentralized or unmanned sites. ● It accommodates a wide temperature range of 40 to 70°C and can adapt to many harsh environments with diverse installation options.

●The ROScube-X RQX-59 series has won the 2023 IoT Edge Computing Excellence Award. ●ROScube is a highly versatile family of robot controllers specially developed for robots equipped with AI, seamlessly integrating with ROS 2 and its vast ecosystem, making it ideal for AMR and autonomous driving solutions. ●The award-winning RQX-59 series is equipped with the NVIDIA Jetson AGX Orin module and can synchronize frames from LiDAR and up to 8 GMSL2/FPD-Link III cameras.

●The ROScube-X RQX-59 series is designed based on the NVIDIA Jetson AGX Orin module, offering a sixfold improvement in AI performance compared to the previous generation. ●ROScube is a versatile modular robot controller family equipped with NVIDIA Jetson modules, designed for robotics and autonomous driving applications specialized in AI, as part of an embedded edge AI platform. ●The ROScube family provides seamless scalability, addressing a wide range of solution requirements across various industries. ●The ROScube family offers comprehensive extension support in the form of sources developed with the NVIDIA JetPack SDK and ADLINK's Neuron SDK, facilitating seamless integration and development.

●Here are the specifications for ADLINK's COM-HPC-cRLS client-type Size C module equipped with the 13th generation Intel Core processor: o Up to 13th generation Intel Core i9 processor, 16 Performance-Cores, 8 Efficient-Cores, and 32 threads o Up to 128GB DDR5 SODIMM at 4000MT/s, and 36MB cache (an increase of 6MB compared to previous models) o PCIe Gen5 x16, 2.5GbE LAN x 2 ●COM-HPC-cRLS supports Intel TCC and Time Sensitive Networking (TSN), making it suitable for hard real-time computing workloads required in applications such as industrial automation, semiconductor equipment testing, and AI robotics.

The SuperCAT series overcomes hardware limitations, supporting synchronous control of up to 128 axes and cycle times ranging from 4ms to 125μs. The SuperCAT series facilitates the integration and simultaneous development of motion control, machine vision, and data analysis. Cost-effective solutions through flexible hardware configurations and software function options. One-stop shopping including EtherCAT main devices and sub-device modules compatible with over 30 partners.

●Unmatched Performance: Equipped with 12th/13th generation Intel Core i9/i7/i5/i3 processors, achieving class-leading performance. ●Ultimate Flexibility: Modular and scalable design that is easy to expand, with optional FM modules to meet domain-specific requirements. ●AI-Ready Edge Platform: With built-in GPU power and machine vision capabilities, the ADLINK MVP-5200/6200 can instantly deploy AI-enabled applications.

●ADLINK and Riyo Electro have launched "Pocket AI" in Japan ●Equipped with NVIDIA RTX A500 ●Pocket-sized portable GPU acceleration ●A powerful alternative source for GPUs ●Elevating performance and mobility to a new dimension ●Software and hardware compatibility ●Over 100 TOPs of high-density INT8 ●For x86 + Windows/Linux users ●High-throughput Thunderbolt 3 interface enables universal connectivity and accelerated data transfer

●Easy Deployment: The slim and lightweight frame design allows for effortless integration and installation tailored to various spaces and applications. ●High Visibility: The wide-viewing angle 16:9 LCD panel and fingerprint-resistant coating ensure clarity. ●Smooth User Interaction: Supports 10-point multi-touch with projected capacitive (PCAP) technology, allowing for smooth operation of gestures such as zoom, flick, rotate, swipe, drag, pinch, press, and double-tap. ●High Durability: The AUO Display Plus direct sales industrial-grade panel, protected by a 7H hardness and IP65 front panel, can easily withstand environmental hazards such as water and dust ingress, scratches, abrasions, and metal particles. ●Wide Range of Size Options: The OM series offers panel sizes of 10.1 inches, 15.6 inches, 18.5 inches, 21.5 inches, 23.8 inches, 27.0 inches, 32.0 inches, and 43.0 inches, while the IM series provides 21.5 inches, 23.8 inches, and 27.0 inches tailored to customer needs.

●Multi-display: Supports four independent displays (FHD/4K/8K) for media playback. ●Excellent edge computing: Advanced Intel processor (Tiger Lake-UP3) delivers high performance for IoT. ●Convenient and well-thought-out design: Compact size, rich I/O and expansion interface support, wireless module (optional). ●Industrial-grade reliability: Fanless design and robust build quality ensure continuous hassle-free system operation.

● The ASD+ Series offers industry-leading reliability with a wide range of operating temperature options. ● Security features and power outage measures protect data and access. ● High-quality original ICs with a 3-year warranty.

● Pocket-sized portable GPU acceleration ● Powerful alternative source of GPU ● Elevating performance and mobility to a new dimension ● Software and hardware compatibility ● Over 100 TOPs of high-density INT8 ● For x86 + Windows/Linux users ● High-throughput Thunderbolt 3 interface enables universal connectivity and fast data transfer

● The new ATX motherboard supports 12th/13th generation Intel Core, Pentium, and Celeron processors. ● Scalable high performance with sufficient I/O and high-speed interfaces provides various features and performance that enhance the use of high-performance cards integrated into complex processing tasks such as smart manufacturing, 5G manufacturing, semiconductors, and machine vision applications. ● The IMB-M47H is currently available for a limited quantity for certified customers and is ready for testing.

●ADLINK's MicroRAN 5G private network provides an economical turnkey solution for small and medium-sized enterprises. ●ADLINK, Askey, and Ataya promise to collaboratively build and develop an all-in-one solution as strategic partners to support companies' intelligent transformation. ●The MicroRAN 5G private network solution will initially be deployed in Taiwan, focusing on smart manufacturing, and will then target the Asia-Pacific region before expanding to the global market.

- Hybrid PLC with customizable HMI vector graphic interface and PC-based software motion control achieves low TCO, easy integration, and high scalability. - 125μs EtherCAT control cycle, up to 128-axis motion control with ADLINK's proprietary SuperCAT, and support for APS function library. - Compatible with Modbus and CANopen automation protocols, enabling seamless communication with over 90% of PLC drivers. - Automatic recording of production data by data logger and immediate push notification service for rapid troubleshooting. - High reliability and optimized cloud service connection for IoT applications via OPCUA, MQTT, and RESTful API.

●ADLINK has successfully obtained ISO 26262 certification, which defines the processes, methods, and tools used in the functional safety and development processes of automotive equipment to ensure that appropriate safety levels are achieved and maintained throughout the automotive lifecycle. ●ADLINK has a proven track record of successfully implementing numerous applications for autonomous (self-driving) vehicles worldwide. ●ADLINK collaborates with strategic partners to provide a complete end-to-end solution for the autonomous driving market through the integration of software and hardware.

● Intralogistics optimized for production lines, material handling, warehousing, and distribution industries. ● A simple and hassle-free implementation with strong heterogeneous integration capabilities between cross-brand AMRs and top-tier modules, as well as IT systems and OT systems. ● Agile AMR operations using SWARM CORE easily adapt to dynamic environmental changes, enabling smarter and safer fleet management.

ADLINK has released the MXM 3.1 Type A module "MXM-AXe" equipped with Intel Arc GPU, featuring up to 8 Xe ray tracing cores, 128 execution units, 4GB GDDR6, and a memory bandwidth of 112GB/s, supporting 8 PCIe Gen4 and 4 4K displays. With built-in hardware ray tracing, dedicated AI acceleration, and AV1 hardware encoding in the Intel GPU, the MXM-AXe becomes an ideal solution for a wide range of graphics and AI inferencing applications, including gaming, medical imaging, media processing, and streaming.

ADLINK's two new modules equipped with Intel's 13th generation Core processors feature an advanced hybrid architecture with performance cores and efficient cores optimized for power usage. ◎Express-RLP: A COM.0 R3.1 Type 6 module offering up to 14 cores, 20 threads, 64GB DDR5 SO-DIMM, PCIe Gen4, and ultra-high durability options with TDP of 15/28/45W. ◎COM-HPC-cRLS: A COM-HPC size C module with up to 24 cores, 128GB DDR5 SO-DIMM, PCIe Gen5, two 2.5GbE LAN ports, and high durability options. Supports Intel TCC and Time Sensitive Networking (TSN), addressing hard real-time computing workloads required in applications such as industrial automation, autonomous driving, AI robotics, and aerospace.

● Vision development kit that achieves seamless integration and affordability with NVIDIA Jetson Nano module, image sensor, and industrial DI/O. ● Add-on AI vision applications and sample code allow for rapid prototyping of AI vision. ● V4L2 video interface makes it easy to access a wealth of NVIDIA, OpenCV, and G-streamer resources. ● ADLINK's proprietary EVA provides AI models, tools for training & labeling, and SOPs, enabling easy and hassle-free PoC construction. ● High scalability: The AI Camera Dev Kit can be seamlessly transitioned to ADLINK's industrial vision devices and systems.

COM Express R3.1 compliant modules – ADLINK releases Express-ADP Type 6 basic size and Express-ID7 Type 7 basic size ● COM.0 R3.1 supports PCIe Gen 4 across all module types, USB4 support in Type 6, CEI sideband signaling for 10G Ethernet, and adds a second PCIe Clock in Type 7. ● In compliance with R3.1, ADLINK offers two new modules and ready-to-use development kits. 〇 Express-ADP Type 6 basic size: Equipped with 12th generation Intel Core, TDP of 15W/28W/45W, supporting up to 6 performance cores (P cores) and 8 efficient cores (E cores) with advanced hybrid architecture. 〇 Express-ID7 Type 7 basic size: Equipped with Intel Xeon D-1700, providing instant responsiveness and performance with up to 4 10G high-speed Ethernet ports and 16 PCIe Gen4 lanes.

ADLINK's edge servers implement edge federated learning, disrupting traditional centralized ML training models and addressing personal information privacy issues to apply in fields where privacy is crucial, such as finance, healthcare, retail, and the internet.

●A short-sized module based on the MediaTek Genio 1200 processor, designed to drive AIoT and 4K graphics applications at the edge, compliant with the SMARC 2.1 specification. ●It features a 2.2GHz octa-core (Cortex-A78 x4 + Cortex-A55 x4) CPU, a 5-core GPU for advanced 3D graphics, an integrated APU (AI Processor Unit) for on-device AI, and supports multiple 4K displays and camera inputs, all configured for excellent power efficiency.

● Conducted pre-validation on ADLINK's MECS series platform to ensure system performance and stability of the 5G acceleration solution. ● Adopted by many mobile communication operators, passed rigorous pre-deployment tests, applied to formal projects, and capable of rapid market entry. ● Compared to FPGA, the PCIe-ACC100 offers a higher performance and more cost-effective FEC accelerator card solution.

ADLINK has announced a COM HPC-based Ampere Altra workstation that is Arm SystemReady SR certified. The ADLINK COM HPC Ampere Altra Developer Platform is available in various configurations including 32/64/80 cores. The Ampere Altra development system is a developer-oriented system based on the Ampere Altra SoC using the Arm Neoverse N1 platform, combining server-class computing power with extremely high scalability. This system supports up to 80 Arm v8.2 64-bit cores at 2.6GHz, with a power consumption of just 150W TDP.

- A vision system equipped with NVIDIA Jetson Xavier NX that supports 4-channel PoE cameras, providing PoE functionality and digital I/O optimized for industrial AI inference. - Smart PoE, PoE loss detection features, and watchdog indicator design reduce maintenance efforts with easy management. - Optimized OS with GigE dedicated bandwidth (EOS-JNX-G) and 100m cable validation ensures capture performance for non-stop operations in quality assurance utilizing AI. - Designed as an AI PoE hub with an uplink port for existing NVRs (Network Video Recorders), enabling easy implementation of safety AI for various applications such as smart cities. - Support for ADLINK's proprietary EVA SDK enables rapid deployment of AI applications with an intuitive GUI and rich plugin options, accelerating proof of concept and reducing time to market.

- Two new modules for embedded and rugged applications equipped with Intel Xeon D processors (development codename: Ice Lake-D), featuring industrial-grade reliability and extended temperature ratings. - COM-HPC-sIDH server-type module - Express-ID7 Type 7 module - Integrates up to 8 x 10G or other configurations of high-speed Ethernet, combined with up to 32 PCIe Gen4 lanes, achieving instantaneous responsiveness and performance. - Equipped with Intel TCC, Deep Learning Boost (VNNI), and AVX-512, optimizing and accelerating AI performance, supporting TSN (Time Sensitive Networking) for precise control of hard real-time workloads across all devices on the network.

● ADLINK's latest model AMP is a 4-axis motion controller card that supports PCI Express interface, a pulse output rate of up to 10MHz, and 64 channels of GPIO. ● ADLINK's AMP-104C/AMP-304C series integrates hardware and software to meet various automated motion requirements in semiconductor, AOI, EMS, LED, and PCB applications. ● ADLINK's APS SDK motion control software supports all ADLINK motion controllers with a single user interface, featuring over 400 APIs.

● The advanced hybrid architecture features up to 6 Performance Cores (P-cores) to enhance single-thread throughput for IoT workloads, and up to 8 Efficient Cores (E-cores) for background task management and multitasking. ● It integrates Intel Iris Xe graphics architecture with up to 96 execution units, supporting four independent 4K60 HDR displays and providing excellent AI performance with Intel Deep Learning Boost. ● Integrated USB4/TBT4 and multiple PCIe Gen4 lanes enable high-speed data transfer and support for class-leading peripherals.

The LEC-RB5 SMARC is a high-performance module equipped with the Qualcomm QRB5165 processor, enabling on-device AI and 5G connectivity for consumer, enterprise, and industrial robotics. It features a high-performance NPU, an octa-core (Arm Cortex-A77 cores x8) CPU, low power consumption, and support for up to six cameras. The Qualcomm QRB5165 processor, customized for robotic applications, is designed to efficiently execute complex AI, deep learning workloads, and edge inference on-device with low power consumption.