COM Express【Express-SL/SLE】
6th generation Intel Xeon, Core, Celeron equipped basic size COM Express Type 6 module
ADLINK's new COM Express products feature the 6th generation Intel Core i7/i5/i3 processors (codenamed Skylake), the latest Xeon, and Celeron processors. These products equipped with the latest Intel processors adopt cutting-edge 14nm microarchitecture and support ultra HD 4K resolution displays. ADLINK's Express-SL/SLE, which supports SEMA Cloud functionality, is designed specifically for IoT (Internet of Things) applications. The Express-SL/SLE connects existing industrial devices and other IoT systems to the cloud, allowing for the extraction of raw data from these devices and determining which data to store locally and which to send to the cloud for detailed analysis. The results of data analysis can be utilized as valuable information for policy decision-making and the creation of innovative business opportunities.
basic information
Basic size COM Express Type 6 module equipped with 6th generation Intel Xeon, Core, and Celeron processors (code name: Skylake) supporting ECC/non-ECC. 【Features】 - Adopts 6th generation Intel Xeon, Core, and Celeron processors and Intel QM170, HM170, CM236 chipsets - Supports up to 32GB of dual-channel DDR4 (2133/1867 MHz) (ECC/non-ECC) - Supports up to 3 independent displays with 3x DDI channels and 1x LVDS (or 4-lane eDP) - Equipped with PCIe x1 x8 and PCIe x16 x1 (3rd generation) - Includes GbE, SATA 6 Gb/s x4, USB 3.0 x4, USB 2.0 x4 - Supports SEMA (Smart Embedded Management Agent) functionality - Supports Extreme Rugged operating temperature range of -40℃ to +85℃ (optional)
Price range
Delivery Time
Model number/Brand name
Express-SL/SLE
Applications/Examples of results
- Machine Automation - Inspection, Measurement, Control - Intelligent Building Automation - Medical Devices, etc.
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News about this product（3）
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COM-HPC: Latest PICMG Computer-on-Module for High-Performance Edge Computing
PICMG (PCI Industrial Computer Manufacturers Group) is in the final stages of developing the latest COM-HPC computer-on-module specification to meet the needs of the highly advanced industrial edge computing market. The COM-HPC specification is intended not to replace COM Express but to expand upon its success, with a release planned by the second quarter of 2020. Edge computing is a rapidly growing field that demands unprecedented levels of performance. The system memory requirements for current and future high-end embedded multicore processors are increasing very sharply. As memory requirements approach 128 GB or 256 GB, current common form factors like COM Express can no longer provide a cost-effective solution. This is why COM HPC is needed. Five sizes have been defined that can be used as server modules capable of accommodating up to eight DIMM sockets onboard.
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Released a new COM Express module featuring the 6th generation Intel Core and the latest Intel Xeon processors.
A new COM (Computer On Module) has been announced that adopts the 6th generation Intel Core i7/i5/i3 processors and the latest Xeon processors. These new modules are designed based on principles of optimal flexibility for upgrades and application scalability, enabling rapid development and market introduction of embedded applications.
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Released products equipped with 6th generation Intel Core and the latest Intel Xeon processors for advanced computing and graphic applications.
On September 30, 2015, ADLINK Technology, a leading global provider of cloud-enabled services for edge devices that realize the Internet of Things (IoT), intelligent gateways, and embedded building blocks, announced the first 14 products featuring the 6th generation Intel Core i7/i5/i3 processors (code name Skylake) and the latest Xeon processors, which are set to be launched in the market in late 2015 and early 2016. These latest Intel processor-based products utilize cutting-edge 14nm microarchitecture and support ultra HD 4K resolution displays. ADLINK's new products include COM Express computer-on-modules in both compact and basic sizes, fanless embedded computers, and Mini-ITX and ATX industrial motherboards.
